Granted Patent
Utility
US 6,833,287 · App. 10/463,007
System for semiconductor package with stacked dies
Inventors:
Hyeong Hur, Henry Descalzo Bathan, Zigmund Ramirez Camacho
Patented Case
View Patent ↗
Granted: Dec 21, 2004
Filed: Jun 16, 2003
Inventors
Hyeong Hur
Henry Descalzo Bathan
Zigmund Ramirez Camacho
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.