Granted Patent
Utility
US 6,833,331 · App. 10/303,935
Method of manufacturing semiconductor integrated circuit device having insulating film formed from liquid substance containing polymer of silicon, oxygen, and hydrogen
Inventors:
Masayoshi Saito, Katsuhiko Hotta, Masayoshi Hirasawa, Masayuki Kojima, Hiroyuki Uchiyama, Hiroyuki Maruyama, Takuya Fukuda
Patented Case
View Patent ↗
Granted: Dec 21, 2004
Filed: Nov 26, 2002
Inventors
Masayoshi Saito
Katsuhiko Hotta
Masayoshi Hirasawa
Masayuki Kojima
Hiroyuki Uchiyama
Hiroyuki Maruyama
Takuya Fukuda
Assignees (at issue)
HITACHI, LTD.
Hitachi Ulsi Systems Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.