Granted Patent
Utility
US 6,833,587 · App. 10/174,328
Heat removal in SOI devices using a buried oxide layer/conductive layer combination
Inventor:
Ming-Ren Lin
Patented Case
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Granted: Dec 21, 2004
Filed: Jun 18, 2002
Inventor
Ming-Ren Lin
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.