Granted Patent
Utility
US 6,833,609 · App. 10/354,772
Integrated circuit device packages and substrates for making the packages
Inventors:
James Fusaro, Robert Francis Darveaux, Pablo Rodriguez
Patented Case
View Patent ↗
Granted: Dec 21, 2004
Filed: Jan 30, 2003
Inventors
James Fusaro
Robert Francis Darveaux
Pablo Rodriguez
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.