Granted Patent
Utility
US 6,833,613 · App. 09/961,646
Stacked semiconductor package having laser machined contacts
Inventors:
Salman Akram, Warren M. Farnworth, Alan G. Wood
Patented Case
View Patent ↗
Granted: Dec 21, 2004
Filed: Sep 25, 2001
Inventors
Salman Akram
Warren M. Farnworth
Alan G. Wood
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.