Granted Patent
Utility
US 6,833,629 · App. 10/020,638
Dual cure B-stageable underfill for wafer level
Inventors:
Bodan Ma, Sun Hee Hong, Quinn K. Tong
Patented Case
View Patent ↗
Granted: Dec 21, 2004
Filed: Dec 14, 2001
Inventors
Bodan Ma
Sun Hee Hong
Quinn K. Tong
Assignee (at issue)
National Starch and Chemical Investment Holding Copporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.