Granted Patent
Utility
US 6,835,600 · App. 10/438,847
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
Inventors:
Masaki Utsumi, Masashi Funakoshi, Tsuyoshi Hamatani, Takeshi Morikawa, Yukio Nakabayashi
Patented Case
View Patent ↗
Granted: Dec 28, 2004
Filed: May 16, 2003
Inventors
Masaki Utsumi
Masashi Funakoshi
Tsuyoshi Hamatani
Takeshi Morikawa
Yukio Nakabayashi
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.