Granted Patent
Utility
US 6,835,643 · App. 10/382,594
Method of improving copper interconnects of semiconductor devices for bonding
Inventor:
Salman Akram
Patented Case
View Patent ↗
Granted: Dec 28, 2004
Filed: Mar 6, 2003
Inventor
Salman Akram
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.