IP Library › Granted Patent US 6,835,660
Granted Patent Utility
US 6,835,660 · App. 10/697,335

Method of manufacturing semiconductor device having metal alloy interconnection that has excellent EM lifetime

Inventor: Tetsuo Usami
Patented Case View Patent ↗
Granted: Dec 28, 2004 Filed: Oct 31, 2003
Inventor
Tetsuo Usami
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,835,660
App. No.
10/697,335
Filed
2003-10-31
Granted
2004-12-28
Kind
B2