IP Library › Granted Patent US 6,836,007
Granted Patent Utility
US 6,836,007 · App. 10/383,734

Semiconductor package including stacked semiconductor chips

Inventors: Kazunari Michii, Jun Shibata
Patented Case View Patent ↗
Granted: Dec 28, 2004 Filed: Mar 10, 2003
Inventors
Kazunari Michii
Jun Shibata
Assignee (at issue)
Renesas Technology Corporation

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Quick Facts
Patent No.
US 6,836,007
App. No.
10/383,734
Filed
2003-03-10
Granted
2004-12-28
Kind
B2