IP Library Granted Patent US 6,845,016
Granted Patent B2
US 6,845,016 · App. 10/241,588 · Granted Jan 18, 2005

Electronic device and method of manufacturing the same, and electronic instrument

Assignee: Seiko Epson Corporation
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Quick Facts
Patent No.
US 6,845,016
App. No.
10/241,588
Granted
Jan 18, 2005
Kind
B2
Abstract

An electronic device includes: a substrate; a plurality of operating elements provided in an operating region of the substrate; a first wiring pattern which is provided outside the operating region in the substrate so that the first wiring pattern has the width longer than the operating region; a first electrode formed in a layer different from the first wiring pattern, partially overlapping the first wiring pattern, and supplying common electrical energy to the operating elements; and a conductive section provided in a region in which the first wiring pattern partially overlaps the first electrode, electrically connecting the first wiring pattern to the first electrode.

Claims (59)

1. An electronic device comprising:

a substrate;

a plurality of operating elements provided on the substrate and defining an operating region thereof;

a first wiring pattern which is provided outside the operating region in the substrate and is longer than the width of the operating region;

a first electrode, provided in a layer different from the first wiring pattern, partially overlapping the first wiring pattern, for supplying electrical energy commonly to the operating elements; and

a conductive section, provided in a region in which the first wiring pattern partially overlaps the first electrode, for electrically connecting the first wiring pattern with the first electrode.

2. The electronic device according to claim 1 , further comprising:

second electrodes provided in accordance with the operating elements to supply the electrical energy to the operating elements;

a plurality of driver circuits electrically connected with the second electrodes for driving the operating elements; and

a second wiring pattern provided between the operating region and the first wiring pattern, and electrically connected to the driver circuits.

3. The electronic device according to claim 1 , further comprising:

an insulating layer provided in a region between the first wiring pattern and the first electrode but except the conductive section.

4. The electronic device according to claim 1 ,

wherein the substrate has a plurality of sides and a plurality of terminals are provided in a region near one of the sides.

5. An electronic instrument comprising the electronic device according to claim 1 .

6. The electronic device according to claim 2 ,

wherein the first electrode faces the second electrodes, at least part of the operating elements being interposed between the first and second electrodes.

7. The electronic device according to claim 2 ,

wherein the first wiring pattern surrounds the operating region with an opening through which a third wiring pattern electrically connected to the operating elements is provided.

8. The electronic device according to claim 2 ,

wherein an electronic circuit for supplying a signal to the driver circuits is provided between the operating region and the first wiring pattern.

9. The electronic device according to claim 2 ,

wherein the second wiring pattern includes a plurality of split wiring patterns which are separated from each other.

10. The electronic device according to claim 8 ,

wherein the first wiring pattern surrounds the operating region and the electronic circuit with an opening through which a third wiring pattern electrically connected to at least one of the operating elements and the electronic circuits is provided.

11. The electronic device according to claim 7 , further comprising:

a plurality of terminals in an end portion of the substrate to which the first, second, and third wiring patterns are electrically connected,

wherein a first group of the terminals to which the first and second wiring patterns are electrically connected is formed at a pitch larger than a pitch of a second group of the terminals to which the third wiring pattern is electrically connected.

12. The electronic device according to claim 9 , wherein:

each of the operating elements has one of light-emitting materials which emit different colors of light from each other; and

the split wiring patterns are provided in accordance with the colors of light.

13. The electronic device according to claim 9 ,

wherein part of at least one of the split wiring patterns and part of the other split wiring patterns are disposed on the opposite sides of the operating region.

14. The electronic device according to claim 9 , wherein:

at least two of the split wiring patterns have portions adjacent to each other between the operating region and an edge portion of the substrate; and

at least the portions of the split wiring patterns adjacent to each other have different widths.

15. The electronic device according to claim 9 ,

wherein at least one of the split wiring patterns has a first section which is adjacent to another one of the split wiring patterns between the operating region and an edge portion of the substrate, and a second section which is wider than the first section.

16. The electronic device according to claim 10 , wherein:

the electronic circuit includes a scanning line driver; and

the third wiring pattern includes an wiring pattern which supplies a data signal to the driver circuits.

17. The electronic device according to claim 10 , further comprising:

a plurality of terminals provided in an end portion of the substrate to which the first, second, and third wiring patterns are electrically connected,

wherein a first group of the terminals to which the first and second wiring patterns are electrically connected is formed at a pitch larger than a pitch of a second group of the terminals to which the third wiring pattern is electrically connected.

18. A method of manufacturing an electronic device comprising:

forming a plurality of operating elements to define an operating region of a substrate;

forming a first wiring pattern which is longer than the operating region outside the operating region;

forming a conductive section on the first wiring pattern; and

forming a first electrode for supplying electrical energy commonly to the operating elements in a layer different from the first wiring pattern so that the first electrode covers the conductive section and partially overlaps the first wiring pattern.

19. The method of manufacturing an electronic device according to claim 18 , further comprising:

providing second electrodes in accordance with the operating elements to supply the electrical energy to the operating elements;

forming a plurality of driver circuits for driving the operating elements to be electrically connected to the second electrodes; and

forming a second wiring pattern between the operating region and the first wiring pattern to be electrically connected to the driver circuits.

20. The method of manufacturing an electronic device according to claim 19 , comprising:

providing to each of the operating elements with one of a plurality of light-emitting materials which emit different colors of light from each other; and

forming a plurality of split wiring patterns separated from each other in accordance with the colors of light.

21. The method of manufacturing an electronic device according to claim 20 , wherein:

forming at least two of the split wiring patterns so as to have portions partially adjacent to each other between the operating region and an edge of the substrate; and

forming at least the portions of the split wiring patterns adjacent to each other so as to have different widths from each other.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2013
From: SEIKO EPSON CORPORATION
To: INTELLECTUAL KEYSTONE TECHNOLOGY LLC
Reel/Frame 030319/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2002
From: MATSUEDA, YOJIRO
To: SEIKO EPSON CORPORATION
Reel/Frame 013311/0632 →
Priority Claims (1)
JP 2001-278628 · Sep 13, 2001 · national
Continuity (1)
Related Publication 20030072141A1 · Apr 17, 2003