Surface mountable light emitting or receiving device
A radiation-emitting and/or radiation-receiving semiconductor component, in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
1. A surface mountable device, comprising:
a lead frame;
a chip carrier part;
a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function;
a connection part positioned at a distance from the chip carrier part;
a trough body positioned at the chip carrier part having a reflective inner surface;
an encapsulation surrounding the semiconductor chip and at least a partial region of the chip carrier part wherein said chip carrier part projects from the encapsulation in the region of the trough body:
said semiconductor chip being secured in said trough body on said chip carrier part and electrically connected to said connection part; and
said chip carrier part being utilized for at least one of an electrical connection and a thermal connection.
2. A surface mountable device as claimed in claim 1 , further comprising:
at least two external connections projecting from the encapsulation, said at least two external connections being directly connected to the connection part, said at least two external connections not being connected to the chip carrier part.
3. A surface mountable device as claimed in claim 1 , further comprising:
at least two external connections protecting from the encapsulation, said at least two external connections being directly connected to the chip carrier part, said at least two external connections not being connected to the connection part.
4. A surface mountable device as claimed in claim 3 , further comprising:
at least two further external connections projecting from the encapsulation, said at least two further external connections being directly connected to the connection part, said at least two further external connections not being connected to the chip carrier part.
5. A surface mountable device as claimed in claim 1 , further comprising:
a reflection-enhancing material coated over at least a portion of the inner surface of the trough.
6. A surface mountable device as claimed in claim 1 , wherein
said encapsulation further comprises a base body having formed a recess therein and a radiation-permeable window arranged in the recess and wherein the semiconductor chip is positioned within the recess.
7. A surface mountable device as claimed in claim 6 , wherein the recess having inner surfaces which are coated at least partially with reflection-enhancing material.
8. A surface mountable device as claimed in claim 1 , wherein the encapsulation is formed completely of a radiation-permeable material.
9. A surface mountable device as claimed in claim 1 , further comprising:
at least one external connection projecting from the encapsulation separate from the chip carrier part,
said at least one external connection being directly connected to the chip carrier part, said at least one external connection not being connected to the connection part.