Temperature compensated vertical pin probing device
An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of a metal alloy, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer of adhesive. The spacers may be composed of foils adhered to one another in a laminated structure. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.
1. An improved temperature compensated vertical pin probing device for probing integrated circuits over a large temperature range, the integrated circuits having spaced contact pads on a circuit substrate to be contacted by probe pins for testing, the probing device including upper and lower spaced die members respectively defining upper and lower patterns of holes theretrough corresponding to the integrated circuit contact pad spacing at a preselected temperature, and a plurality of probe pins, each pin being disposed in a pair of upper and lower boles and extending beyond the lower die to terminate in a probe tip, said vertical pin probing device comprising;
a die member including a plastic film and a metal housing having first and second sides, the first side being adjacent to the plastic film and the second side being adjacent to the circuit substrate, and
a thermally compliant adhesive joining the plastic film with the metal housing, the adhesive having a coefficient of thermal expansion substantially matching that of the metal housing;
wherein the compliant adhesive permits small differences in material growth while minimizing or avoiding the introduction of deformation or buckling of the plastic film; and
wherein the plastic film and the metal housing have about the same relative CTE values for permitting compliance to an assembly subjected to thermal gradients over large areas.
2. The improvement according to claim 1 , wherein said thermally compliant adhesive is about a 2 mil thick compliant transfer adhesive.