IP Library Granted Patent US 6,958,443
Granted Patent B2
US 6,958,443 · App. 10/440,992 · Granted Oct 25, 2005

Low power thermoelectric generator

Assignee: Applied Digital Solutions
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Quick Facts
Patent No.
US 6,958,443
App. No.
10/440,992
Filed
May 19, 2003
Granted
Oct 25, 2005
Kind
B2
Art Unit
1753
USPC
136/238
Abstract

Disclosed is a foil segment for a thermoelectric generator comprising a top plate disposed in spaced relation above a bottom plate. An array of the foil segments is perpendicularly disposed in side-by-side arrangement between and in thermal contact with the bottom and top plates. Each foil segment comprises a substrate having a thickness of about 7.5-50 microns, opposing front and back substrate surfaces and a series of spaced alternating n-type and p-type thermoelectric legs disposed in parallel arrangement on the front substrate surface. Each of the n-type and p-type legs is formed of a bismuth telluride-based thermoelectric material having a thickness of about 5-100 microns, a width of about 10-100 microns and a length of about 100-500 microns. The alternating n-type and p-type thermoelectric legs are electrically connected in series and thermally connected in parallel such that a temperature differential between the bottom and top plates results in the generation of power.

Claims (17)

1. A foil segment for a thermoelectric generator, the foil segment comprising:

a substrate having opposing front and back substrate surfaces; and

a series of elongate alternating n-type and p-type thermoelectric legs disposed in spaced parallel arrangement on the front substrate surface, each of the n-type and p-type legs being formed of a Bi 2 Te 3 -type thermoelectric material having a thickness in the range of from about 5 microns to about 100 microns, each n-type and p-type thermoelectric leg having a width and a length, the width being in the range of from about 10 microns to about 100 microns, the length being in the range of from about 100 microns to about 500 microns; wherein:

each one of the p-type thermoelectric legs is electrically connected to an adjacent one of the n-type thermoelectric legs at opposite ends of the p-type thermoelectric legs such that the series of n-type and p-type thermoelectric legs are electrically connected in series and thermally connected in parallel;

the Bi 2 Te 3 -type thermoelectric material for the p-type thermoelectric legs being a semiconductor compound having the following formula:

(Bi 0.15 Sb 0.85 ) 2 Te 3 plus about 10 at % Te excess to about 30 at % Te excess.

2. The foil segment of claim 1 wherein the semiconductor compound has about 18 at % Te excess.

3. The foil segment of claim 1 wherein each one of the p-type thermoelectric legs has a width of about 40 microns.

4. A foil segment for a thermoelectric generator, the foil segment including a plurality of n-type and p-type thermoelectric legs, each one of the p-type thermoelectric legs being formed of a semiconductor compound having the following formula:

(Bi 0.15 Sb 0.85 ) 2 Te 3 plus about 10 at % Te excess to about 30 at % Te excess.

5. The foil segment of claim 4 wherein the semiconductor compound has about 18 at % Te excess.

6. A foil segment for a thermoelectric generator, the foil segment comprising:

a substrate having a thickness in the range of from about 7.5 microns to about 50 microns and including opposing front and back substrate surfaces, the substrate formed of an electrically insulating material having a low thermal conductivity; and

a series of spaced alternating n-type and p-type thermoelectric legs disposed in parallel arrangement on each one of the front substrate surfaces, each of the n-type and p-type legs being formed of a Bi 2 Te 3 -type thermoelectric material and having a thickness in the range of from about 5 microns to about 100 microns, each n-type and p-type thermoelectric leg having a width and a length, the width being in the range of from about 10 microns to about 100 microns and the length being in the range of from about 100 microns to about 500 microns; wherein:

each one of the p-type thermoelectric legs is electrically connected to adjacent n-type thermoelectric legs at opposite ends of the p-type thermoelectric legs such that the series of n-type arid p-type thermoelectric legs are electrically connected in series and thermally connected in parallel;

each one of the p-type thermoelectric legs being formed of a semiconductor compound having the following formula:

(Bi 0.15 Sb 0.85 ) 2 Te 3 plus about 18 at % Te excess.

Assignments (10)
RELEASE (REEL 030833 / FRAME 0469) Recorded Apr 2, 2019
From: BANK OF AMERICA, N.A.
To: ALLFLEX, USA, INC.; DESTRON FEARING CORPORATION; GT ACQUISITION SUB, INC.; DIGITAL ANGEL CORPORATION
Reel/Frame 048762/0555 →
RELEASE (REEL 030825 / FRAME 0310) Recorded Apr 2, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ALLFLEX, USA, INC.; DESTRON FEARING CORPORATION; GT ACQUISITION SUB, INC.; DIGITAL ANGEL CORPORATION
Reel/Frame 049126/0851 →
SECOND LIEN SECURITY AGREEMENT Recorded Jul 19, 2013
From: ALLFLEX USA, INC.; DESTRON FEARING CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 030833/0469 →
FIRST LIEN SECURITY AGREEMENT Recorded Jul 18, 2013
From: ALLFLEX USA, INC.; DESTRON FEARING CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 030825/0310 →
RELEASE OF SECURITY INTEREST Recorded Jul 26, 2011
From: TCI BUSINESS CAPITAL, INC.
To: DIGITAL ANGEL CORPORATION; DIGITAL ANGEL TECHNOLOGY CORPORATION; FEARING MANUFACTURING CO., INC.; GT ACQUISITION SUB, INC.; DESTRON FEARING CORPORATION
Reel/Frame 026648/0034 →
SECURITY AGREEMENT Recorded Sep 2, 2010
From: DESTRON FEARING CORPORATION; DIGITAL ANGEL CORPORATION; DIGITAL ANGEL TECHNOLOGY CORPORATION; FEARING MANUFACTURING CO., INC.; GT ACQUISITION SUB, INC.
To: TCI BUSINESS CAPITAL, INC.
Reel/Frame 024933/0139 →
CHANGE OF NAME Recorded Jul 24, 2008
From: APPLIED DIGITAL SOLUTIONS, INC.
To: DIGITAL ANGEL CORPORATION
Reel/Frame 021291/0021 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Nov 30, 2007
From: APPLIED DIGITAL SOLUTIONS, INC.
To: KALLINA CORPORATION
Reel/Frame 020174/0793 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Nov 30, 2007
From: APPLIED DIGITAL SOLUTIONS, INC.
To: LAURUS MASTER FUND, LTD.
Reel/Frame 020270/0386 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2003
From: STARK, INGO; ZHOU, PETER
To: APPLIED DIGITAL SOLUTIONS
Reel/Frame 014437/0252 →
Continuity (1)
Related Publication 20040231714A1 · Nov 25, 2004