Waveguide to stripline transition with via forming an impedance matching fence
The invention relates to a device for guiding electromagnetic waves from a wave guide ( 10 ), in particular a multi-band wave guide, to a transmission line ( 20 ), in particular a micro strip line, arranged at one end of the wave guide ( 10 ), comprising coupling means ( 30 - 1, . . . , 30 - 7 ) for mechanical fixation and impedance matching between the wave guide ( 10 ) and the transmission line ( 20 ). It is the object of the invention to improve such a structure in the way that manufacturing is made easier and less expensive than according to prior art. According to the present invention that object is solved in the way that the coupling means comprises at least one dielectric layer ( 30 ) being mechanically connected with the main plane of the transmission line, the geometric dimension of that at least one dielectric layer extending along the propagation direction of the electromagnetic waves being correlated with the center frequency of electromagnetic waves in order to achieve optimised impedance matching.
1. Device for guiding electromagnetic waves from a wave guide, to a transmission line, arranged at one end of the wave guide, comprising coupling means for mechanical fixation and impedance matching between the wave guide and the transmission line,
where the coupling means comprises at least two dielectric layers being mechanically connected with a main plane of the transmission line, and
where, in the at least two dielectric layers, a plurality of electrically conducting vias provide a fence-like arrangement and define the lateral dimensions of the part of the at least two dielectric layers effective for the transition of the waves,
wherein said lateral dimensions of at least one of the at least two dielectric layers differ from the lateral dimensions of the other dielectric layers in a way that optimised impedance matching for a given center frequency of the electromagnetic waves is achieved, and
wherein the thickness of at least one of the at least two dielectric layers differs from the thickness of the other dielectric layers and
that the thickness of said at least one of the at least two dielectric layers is determined in a way that optimised impedance matching for a given center frequency of the electromagnetic waves is achieved.
2. The device according to claim 1 ,
wherein a metal layer is arranged in a sandwich structure of dielectric layers adjacent to a substrate layer of the transmission line.
3. The device according to claim 1 ,
wherein at least one additional layer is provided within the coupling means, said additional layer confining an air filled cavity.
4. The device according to claim 3 ,
wherein the cavity is aligned with an opening of the wave guide.
5. The device according to claim 1 ,
wherein the attachment of the wave guide to the dielectric layer adjacent to the wave guide is made by a soldering or welding or glueing connection.
6. The device according to claim 5 ,
wherein the soldering connection is using solder balls.
7. The device according to claim 1 ,
wherein the lateral dimension of the fence via structure in an additional layer is located in half wave length distance from the cavity.
8. The device according to claim 1 ,
wherein the transmission line is a microstrip line.
9. The device according to claim 1 ,
wherein the transmission line is a stripline.
10. The device according to claim 1 , wherein the transmission line is a coplanar wave guide.
11. The device according to claim 1 ,
wherein the vias are electrically connected with conducting pads according to given surface patterns, the pads extending along at least one main area of the at least two dielectric layers.
12. The device according to claim 11 ,
wherein conducting pads of adjacent dielectric layers are electrically connected to each other.
13. The device according to claim 1 ,
wherein the vias of different dielectric layers are adjacent to each other.
14. The device according to claim 1 , wherein each of said dielectric layers has a predetermined thickness in a way that the total dielectric thickness of a sandwich structure of dielectric layers is adapted to the center frequency of the electromagnetic waves.
15. The device according to claim 1 ,
wherein the vias in said at least two dielectric layers comprise a variety of staggered vias in different dielectric layers.
16. The device according to claim 1 ,
wherein the structure comprising at least one dielectric layer is soldered or welded, to a substrate layer of the transmission line.
17. The device according to claim 1 ,
wherein the transmission line is an integral part of the coupling means.