IP Library Granted Patent US 6,971,243
Granted Patent B2
US 6,971,243 · App. 10/710,792 · Granted Dec 6, 2005

Heat sink

Assignee: Coolit Systems Inc.
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Quick Facts
Patent No.
US 6,971,243
App. No.
10/710,792
Granted
Dec 6, 2005
Kind
B2
Abstract

A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.

Claims (18)

1. A heat sink comprising: a first thermal plate, a second thermal plate, a plurality of adjacent fins integral with and extending between both the first thermal plate and the second thermal plate, the plurality of adjacent fins each having interfacing side surfaces, and a plurality of end spacers mounted between the plurality of adjacent fins to space and form fluid passages between the interfacing side surfaces thereof and the plurality of adjacent fins each extending continuously between the first thermal plate and the second thermal plate to establish laminar fluid flow through the fluid passages.

2. The heat sink of claim 1 wherein first and second thermal plates are positioned at external sides of the heat sink.

3. The heat sink of claim 1 wherein the thermal plates are positioned at opposite ends of the heat sink with the plurality of adjacent fins extending substantially perpendicularly therebetween.

4. The heat sink of claim 1 further comprising an outer insulative coating applied to the outer surfaces of the heat sink to prevent heat from radiating outwardly from the heat sink except into passages between the plurality of adjacent fins.

5. The heat sink of claim 1 further comprising a third thermal plate integral with the plurality of fins and positioned between the first thermal plate and the second thermal plate.

6. The heat sink of claim 1 wherein the plurality of adjacent fins are each substantially planar along their interfacing side surfaces.

7. The heat sink of claim 1 wherein the plurality of adjacent fins are each 0.5 to 1.5 mm thick between the interfacing side surfaces.

8. The heat sink of claim 1 wherein the plurality of adjacent fins are each spaced a distance of 1.0 to 2.5 mm to form the fluid passages between the interfacing side surfaces.

9. The heat sink of claim 1 wherein the plurality of adjacent fins are each spaced with their interfacing side surfaces in parallel.

10. The heat sink of claim 1 further comprising additional fins in heat conduction communication with the first thermal plate.

11. A heat sink comprising: a first thermal plate, a second thermal plate, a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate, and an outer insulative coating applied to outer surfaces of the heat sink to prevent heat from radiating outwardly from the heat sink except into passages between the fins.

12. The heat sink of claim 11 wherein first and second thermal plates are positioned at external sides of the heat sink.

13. The heat sink of claim 11 wherein the thermal plates are positioned at opposite ends of the heat sink with the fins extending substantially perpendicularly therebetween.

14. The heat sink of claim 11 further comprising a third thermal plate integral with the plurality of fins and positioned between the first thermal plate and the second thermal plate.

15. A heat sink comprising: a first thermal plate, a second thermal plate, a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate and a third thermal plate integral with the plurality of fins and positioned between the first thermal plate and the second thermal plate.

16. The heat sink of claim 15 wherein first and second thermal plates are positioned at external sides of the heat sink.

17. The heat sink of claim 15 wherein the thermal plates are positioned at opposite ends of the heat sink with the fins extending substantially perpendicularly therebetween.

18. The heat sink of claim 15 further comprising an outer insulative coating applied to outer surfaces of the heat sink to prevent heat from radiating outwardly from the heat sink except into passages between the fins.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 2, 2026
From: ATB FINANCIAL
To: COOLIT SYSTEMS INC.
Reel/Frame 075164/0029 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2022
From: COMERICA BANK
To: COOLIT SYSTEMS INC.
Reel/Frame 059380/0518 →
SECURITY INTEREST Recorded Dec 23, 2020
From: COOLIT SYSTEMS INC.
To: ATB FINANCIAL
Reel/Frame 054739/0750 →
SECURITY AGREEMENT Recorded Jan 8, 2013
From: COOLIT SYSTEMS INC.
To: COMERICA BANK, A TEXAS BANKING ASSOCIATION AND AUTHORIZED FOREIGN BANK UNDER THE BANK ACT (CANADA)
Reel/Frame 029586/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2004
From: SCOTT, ALEXANDER R. W.
To: COOLIT SYSTEMS INC.
Reel/Frame 015295/0503 →
Continuity (2)
Provisional Application 6048121300 · Aug 12, 2003
Related Publication 20050045313A1 · Mar 3, 2005