Laser diode with metal-oxide upper cladding layer
A nitride-based laser diode structure utilizing a metal-oxide (e.g., Indium-Tin-Oxide (ITO) or Zinc-Oxide (ZnO)) in place of p-doped AlGaN to form the upper cladding layer. An InGaN laser diode structure utilizes ITO upper cladding structure, with an SiO 2 isolation structure formed on opposite sides of the ITO upper cladding structure to provide a lateral index step that is large enough to enable lateral single-mode operation. The lateral index step is further increased by slightly etching the GaN:Mg waveguide layer below the SiO 2 isolation structure. An optional p-type current barrier layer (e.g., AlGaN:Mg having a thickness of approximately 20 nm) is formed between the InGaN-MQW region and a p-GaN upper waveguide layer to impede electron leakage from the InGaN-MQW region.
1. A laser diode structure comprising:
a quantum well region;
a waveguide layer formed over the quantum well region; and
a conductive metal-oxide cladding layer formed on the waveguide layer,
wherein the quantum well region comprises alternating layers of Indium-Gallium-Nitride and Gallium-Nitride, and
wherein the waveguide layer comprises Gallium-Nitride doped with Magnesium (GaN:Mg).
2. The laser diode structure according to claim 1 , wherein the metal-oxide cladding layer comprises at least one of Indium-Tin-Oxide (ITO), Zinc-Oxide (ZnO), Cadmium-Oxide (edo), Tin-Oxide (SnO).
3. The laser diode structure according to claim 1 ,
wherein the waveguide layer comprises a thickness in the range of 50 to 200 nm, and
wherein the metal-oxide cladding layer comprises at least one of Indium-Tin-Oxide (ITO), Zinc-Oxide (ZnO), Cadmium-Oxide (CdO), Tin-Oxide (SnO).
4. The laser diode structure according to claim 3 , wherein the metal-oxide cladding layer comprises ITO having a thickness in the range of 200 and 1000 nm.
5. A laser diode structure comprising:
a quantum well region;
a waveguide layer formed over the quantum well region; and
a conductive metal-oxide cladding layer formed on the waveguide layer,
wherein the metal-oxide cladding layer comprises first and second side walls extending perpendicular to an upper surface of the waveguide layer, and wherein the laser diode structure further comprising an isolation layer formed on the waveguide layer and including a first portion contacting the first side wall of the metal-oxide cladding layer, and a second portion contacting the second side wall of the metal-oxide cladding layer.
6. The laser diode structure according to claim 5 , wherein the metal-oxide cladding layer comprises at least one of Indium-Tin-Oxide (ITO), Zinc-Oxide (ZnO), Cadmium-Oxide (CdO), Tin-Oxide (SnO), and wherein the isolation layer comprises one of Silicon-Oxide (SiO 2 ), Silicon-Nitride (Si 3 N 4 ), Silicon-Oxy-Nitride (SiON) and air.
7. The laser diode structure according to claim 5 ,
wherein the quantum well region comprises alternating layers of Indium-Gallium-Nitride and Gallium-Nitride,
wherein the waveguide layer comprises Gallium-Nitride doped with Magnesium (GaN:Mg) and having a thickness in the range of 50 to 200 nm, and
wherein the metal-oxide cladding layer comprises ITO having a thickness in the range of 100 to 1000 nm, and
wherein the isolation layer comprises SiO 2 having a thickness in the range of 50 to 500 nm.
8. The laser diode structure according to claim 7 , further comprising a metal electrode formed on an upper surface of the ITO cladding layer.
9. The laser diode structure according to claim 7 , wherein a thickness of a first portion of the waveguide layer located under the metal-oxide cladding layer is in a range of approximately 5 nm to approximately 50 nm thicker than a second portion of the waveguide layer located under the isolation layer.
10. The laser diode structure according to claim 1 , further comprising a current barrier layer formed between the quantum well region and the waveguide layer.
11. The laser diode structure according to claim 10 ,
wherein the current barrier layer comprises Aluminum-Gallium-Nitride doped with Magnesium (AlGaN:Mg) and having a thickness in the range of 5 to 50 nm,
wherein the waveguide layer comprises a thickness in the range of 50 to 200 nm, and
wherein the metal-oxide cladding layer comprises one of Indium-Tin-Oxide (ITO) and Zinc-Oxide (ZnO) having a thickness in the range of 100 to 1000 nm.
12. A method for fabricating a laser diode structure comprising:
forming a quantum well region;
forming a waveguide layer over the quantum well region; and
forming a conductive metal-oxide cladding layer on the waveguide layer,
wherein forming the quantum well region comprises forming alternating layers of Indium-Gallium-Nitride and Gallium-Nitride, and
wherein forming the waveguide layer comprises depositing Gallium-Nitride doped with Magnesium (GaN:Mg).
13. The method according to claim 12 , wherein forming the metal-oxide cladding layer comprises depositing at least one of Indium-Tin-Oxide (ITO), Zinc-Oxide (ZnO), Cadmium-Oxide (CdO), Tin-Oxide (SnO).
14. The method according to claim 12 , wherein forming the metal-oxide cladding layer comprises depositing ITO to a thickness in the range of 100 to 1000 nm.
15. The method according to claim 12 , wherein forming the metal-oxide cladding layer comprises depositing an Indium-Tin-Oxide (ITO) layer, and then etching portions of the ITO layer to form an ITO structure having side walls extending perpendicular to an upper surface of the waveguide layer.
16. The method according to claim 15 , further comprising forming an isolation layer on the waveguide layer adjacent to the ITO structure such that the isolation layer includes a first portion contacting the first side wall of the ITO structure, and a second portion contacting the second side wall of the ITO structure.
17. The method according to claim 16 , wherein forming the isolation layer comprises depositing Silicon-Oxide (SiO 2 ).
18. The method according to claim 17 , wherein forming the waveguide layer comprises etching portions of the waveguide layer such that the SiO 2 is deposited on the etched portions.
19. The method according to claim 17 , wherein the etched portions have a thickness in the range of 50 to 100 nm.