IP Library Granted Patent US 6,996,425
Granted Patent B2
US 6,996,425 · App. 10/011,032 · Granted Feb 7, 2006

Cellular phone housing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,996,425
App. No.
10/011,032
Granted
Feb 7, 2006
Kind
B2
Abstract

There is provided a cellular phone housing formed with a base made of a resin material by molding, wherein the base is coated with a metal multilayer including a lower metal layer formed on a surface of the base with metal plating and an upper metal layer formed on the lower metal layer with metal plating, and wherein the lower metal layer is made of a first metal which is ductile and the upper metal layer is made of a second metal which is brittle compared with that of the first metal.

Claims (16)

1. A cellular phone housing formed with a base made of a resin material by molding, wherein said base is coated with a metal multilayer comprising a lower metal layer formed on a surface of said base with metal plating and an upper metal layer formed on said lower metal layer with metal plating, and wherein said lower metal layer is made of a first metal which is ductile and said upper metal layer is made of a second metal which is brittle compared with that of said first metal, wherein a ratio in thickness between said lower metal layer and said upper metal layer is from 4:1 to 5:1.

2. The cellular phone housing according to claim 1 , comprising an upper-side housing portion and a lower-side housing portion connected to each other by a hinge, the hinge capable of folding said upper-side housing portion and said lower-side housing portion relative to each other; and

said metal multilayer is formed on either one or both of said upper-side housing portion and said lower-side housing portion.

3. The cellular phone housing according to claim 2 , wherein:

said upper-side housing portion and said lower-side housing portion are made of a top cover and a bottom cover respectively; and said metal multilayer is formed on either one or both of said top cover and said bottom cover.

4. The cellular phone housing according to claim 1 , wherein said resin material comprises a poly-carbonate resin or an ABS (Acrylonitrile Butadiene Styrene) resin.

5. The cellular phone housing according to claim 1 , wherein said lower metal layer is made of copper (Cu) and said upper metal layer is made of nickel (Ni).

6. A cellular phone housing formed with a base made of a resin material by molding, wherein said base is coated with a metal multilayer comprising a lower metal layer formed on a surface of said base with metal plating and an upper metal layer formed on said lower metal layer with metal plating, and wherein said lower metal layer is made of a first metal which is ductile and said upper metal layer is made of a second metal which is brittle compared with that of said first metal, wherein said lower metal layer comprises a first copper layer formed on said surface of said base with chemical plating and a second copper layer formed on said first copper layer with electroplating.

7. The cellular phone housing according to claim 6 , comprising an upper-side housing portion and a lower-side housing portion connected to each other by a hinge, the hinge capable of folding said upper-side housing portion and said lower-side housing portion relative to each other; and

said metal multilayer is formed on either one or both of said upper-side housing portion and said lower-side housing portion.

8. The cellular phone housing according to claim 7 , wherein:

said upper-side housing portion and said lower-side housing portion are made of a top cover and a bottom cover respectively; and

said metal multilayer is formed on either one or both of said top cover and said bottom cover.

9. The cellular phone housing according to claim 6 , wherein said lower metal layer is made of copper (Cu) and said upper metal layer is made of nickel (Ni).

10. The cellular phone housing according to claim 6 , wherein said resin material comprises a poly-carbonate resin or an ABS (Acrylonitrile Butadiene Styrene) resin.

11. The cellular phone housing according to claim 6 , wherein a ratio in thickness between said lower metal layer and said upper metal layer is from 4:1 to 5:1.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2014
From: NEC CORPORATION
To: LENOVO INNOVATIONS LIMITED (HONG KONG)
Reel/Frame 033720/0767 →