IP Library Granted Patent US 7,002,697
Granted Patent B2
US 7,002,697 · App. 10/211,970 · Granted Feb 21, 2006

Tunable optical instruments

Assignee: Aegis Semiconductor, Inc.
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Quick Facts
Patent No.
US 7,002,697
App. No.
10/211,970
Granted
Feb 21, 2006
Kind
B2
Abstract

An optical instrument including: a thermo-optically tunable, thin film, free-space interference filter having a tunable passband which functions as a wavelength selector, the filter including a sequence of alternating layers of amorphous silicon and a dielectric material deposited one on top of the other and forming a Fabry-Perot cavity structure having: a first multi-layer thin film interference structure forming a first mirror; a thin-film spacer layer deposited on top of the first multi-layer interference structure, the thin-film spacer layer made of amorphous silicon; and a second multi-layer thin film interference structure deposited on top of the thin-film spacer layer and forming a second mirror; a lens for coupling an optical beam into the filter; an optical detector for receiving the optical beam after the optical beam has interacted with the interference filter; and circuitry for heating the thermo-optically tunable interference filter to control a location of the passband.

Claims (26)

1. An optical instrument comprising:

a thermo-optically tunable, thin film, free-space interference filter having a tunable passband which functions as a wavelength selector, said filter comprising a sequence of alternating layers of amorphous silicon and a dielectric material deposited one on top of the other, said sequence of alternating layers forming a Fabry-Perot cavity structure including: a first multi-layer thin film interference structure forming a first mirror; a thin-film spacer layer deposited on a top surface of the first multi-layer thin-film interference structure, said thin-film spacer layer made of amorphous silicon; and a second multi-layer thin film interference structure deposited on a top surface of the thin-film spacer layer and forming a second mirror;

a lens for coupling an optical beam into the filter;

an optical detector for receiving the optical beam after the optical beam has interacted with the interference filter; and

circuitry for heating the thermo-optically tunable interference filter to control a location of the passband.

2. The optical instrument of claim 1 , wherein the optical instrument is an optical spectrum analyzer.

3. The optical instrument of claim 2 , wherein the optical spectrum analyzer is constructed and arranged as an optical channel monitor for wavelength-division multiplexed optical communication systems.

4. The optical instrument of claim 1 , wherein the transparent layer is a transparent conducting oxide.

5. The optical instrument of claim 1 , wherein the dielectric material is silicon nitride.

6. The optical instrument of claim 5 , wherein the filter has a multi-cavity structure.

7. The optical instrument of claim 5 , further comprising a single hermetic package, wherein the filter and the optical detector are mounted in the single hermetic package.

8. The optical instrument of claim 7 , wherein the single hermetic package is a transistor outline (TO-style) package.

9. The optical instrument of claim 7 , further comprising within the single hermetic package one or more discrete temperature sensors.

10. The optical instrument of claim 7 , further comprising within the single hermetic package one or more temperature-stabilizing devices.

11. The optical instrument of claim 5 , further comprising a device that measures temperature of the thermo-optically tunable filter to determine wavelength.

12. The optical instrument of claim 11 , wherein the device that measures the temperature is integrated with the filter.

13. The optical instrument of claim 5 , further comprising a signal processor connected to receive an output signal from the detector, the signal processor converting the output signal received from the detector to power v. wavelength data.

14. The optical instrument of claim 5 , further comprising an electronics module;

a fiber optic input; and

a transistor outline (TO) package into which are mounted the tunable free-space filter, the optical detector and the fiber optic input, the TO package including pins through which electrical connections between the tunable free-space filter and the optical detector, and the electronics module are made.

15. The optical instrument of claim 5 , wherein the filter further comprises a layer of electrically resistive material to which, during use, power is supplied by said circuitry to change the temperature of the filter and thereby shift the passband of the filter.

16. The optical instrument of claim 15 , wherein the filter further comprises a substrate on which the first multi-layer thin film interference structure is deposited, wherein said layer of electrically resistive material forms a ring heater on the substrate and circumscribing an optical path through the first and second Fabry-Perot cavity structures, wherein during use the power that is supplied to the ring heater by said circuitry is electrical power.

17. The optical instrument of claim 15 , wherein the filter further comprises a crystalline semiconductor substrate on which the first multi-layer thin film interference structure is deposited, wherein said layer of electrically resistive material is a doped upper region of said substrate, wherein during use the power that is supplied to the doped upper region by said circuitry is electrical power.

18. The optical instrument of claim 15 , wherein the filter further comprises a substrate and a heater film formed in the substrate, wherein the first multi-layer thin film interference structure is deposited on the heater film, wherein said layer of electrically resistive material is said heater film and wherein during use the power that is supplied to the heater film by said circuitry is electrical power.

19. The optical instrument of claim 15 , wherein said layer of electrically resistive material is one of the layers of the Fabry-Perot cavity structure.

20. The optical instrument of claim 15 , wherein said layer of electrically resistive material is an optically transparent layer that is integrated with the filter in a location such that light passes through the electrically resistive material.

Assignments (7)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2022
From: II-VI PHOTONICS, (US) INC.
To: II-VI DELAWARE, INC.
Reel/Frame 060333/0742 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
CHANGE OF NAME Recorded May 6, 2014
From: PHOTOP AEGIS, INC.
To: II-VI PHOTONICS, (US) INC.
Reel/Frame 032835/0420 →
CHANGE OF NAME Recorded May 17, 2013
From: AEGIS LIGHTWAVE, INC.
To: PHOTOP AEGIS, INC.
Reel/Frame 030452/0216 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2002
From: DOMASH, LAWRENCE H.; PAYNE, ADAM M.; MA, EUGENE Y.; NEMCHUK, NIKOLAY; WU, MING; MURANO, ROBERT; SHERMAN, STEVEN; WAGNER, MATTHIAS
To: AEGIS SEMICONDUCTOR, INC.
Reel/Frame 013638/0334 →
Continuity (7)
Provisional Application 6030970400 · Aug 2, 2001
Provisional Application 6031004700 · Aug 4, 2001
Provisional Application 6032220800 · Sep 14, 2001
Provisional Application 6033517800 · Nov 28, 2001
Provisional Application 6038697300 · Jun 6, 2002
Provisional Application 6039450000 · Jul 9, 2002
Related Publication 20030072009A1 · Apr 17, 2003