Card-type LED illumination source
An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.
1. An LED illumination source comprising:
a metal base substrate including a line pattern and an insulating layer comprising a composite material with an inorganic filler and a resin composition, and
LED bare chips mounted on one surface of the metal base substrate,
wherein an optical reflector with holes to surround the LED bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted, and
wherein stress relaxing means is provided between the metal base substrate and the optical reflector.
2. The LED illumination source of claim 1 , wherein a thermal resistance between the back surface of the metal base substrate, on which none of the LED bare chips is mounted, and the LED bare chips is 10° C./W or less.
3. The LED illumination source of claim 2 , wherein the thermal resistance is 5° C./W or less.
4. The LED illumination source of claim 2 , wherein the thermal resistance is 2° C./W or less.
5. The LED illumination source of claim 1 , wherein the inorganic filler is comprises at least one material selected from the group consisting of Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 and AlN.
6. The LED illumination source of claim 1 , wherein the LED bare chips are provided as either surface mount devices (SMDs) or chip elements.
7. An LED illumination source comprising:
a metal base substrate including at least one insulating layer, each layer comprising a composite material with an inorganic filler and a resin composition,
LED bare chips mounted on one surface of the metal base substrate, and
at least two conductive line pattern layers stacked one upon the other with at least one insulating layer interposed between them, wherein the illumination source has a structure for interconnecting the at least two conductive line pattern layers together at a predetermined position of the insulating layer.
8. The LED illumination source of claim 7 , wherein a thermal resistance between the back surface of the metal base substrate, on which none of the LED bare chips is mounted, and the LED bare chips is 10° C./W or less.
9. The LED illumination source of claim 8 , wherein the thermal resistance is 5° C./W or less.
10. The LED illumination source of claim 8 , wherein the thermal resistance is 2° C./W or less.
11. The LED illumination source of claim 7 , wherein the inorganic filler comprises at least one material selected from the group consisting of Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 and AlN.
12. The LED illumination source of claim 7 , wherein the LED bare chips are provided as either surface mount devices (SMDs) or chip elements.