IP Library Granted Patent US 7,045,832
Granted Patent B2
US 7,045,832 · App. 10/755,567 · Granted May 16, 2006

Vertical optical path structure for infrared photodetection

Assignee: Sharp Laboratories of America, Inc.
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Quick Facts
Patent No.
US 7,045,832
App. No.
10/755,567
Granted
May 16, 2006
Kind
B2
Abstract

Provided are a SiGe vertical optical path and a method for selectively forming a SiGe optical path normal structure for IR photodetection. The method comprises: forming a Si substrate surface; forming a Si feature, normal with respect to the Si substrate surface, such as a trench, via, or pillar; and, selectively forming a SiGe optical path overlying the Si normal feature. In some aspects, the Si substrate surface is formed a first plane and the Si normal feature has walls (sidewalls), normal with respect to the Si substrate surface, and a surface in a second plane, parallel to the first plane. Then, selectively forming a SiGe optical path overlying the Si normal feature includes forming a SiGe vertical optical path overlying the normal feature walls.

Claims (33)

1. A silicon-germanium (SiGe) vertical optical path structure for infrared (IR) photodetection, the structure comprising:

a Si substrate with a surface in a first plane;

a Si feature, normal with respect to the Si substrate surface, wherein the normal feature includes walls, normal with respect to the Si substrate surface, and a surface in a second plane, parallel to the first plane; and,

a SiGe vertical optical path, formed overlying the Si normal feature walls, normal with respect to the Si substrate surface.

2. The structure of claim 1 further comprising:

a dielectric layer overlying the Si substrate surface and the normal feature surface.

3. The structure of claim 1 wherein the Si normal feature is selected from the group including a via, trench, and pillar.

4. The structure of claim 1 wherein the SiGe vertical optical path has a thickness in the range of 5 to 1000 nanometers (nm).

5. The structure of claim 1 wherein the SiGe vertical optical path has an optical path length in the range of 0.1 to 10 microns.

6. The structure of claim 1 wherein the SiGe vertical optical path includes SiGe with a Ge concentration in the range from 5 to 100%.

7. The structure of claim 1 wherein the SiGe vertical optical path includes SiGe with a graded Ge concentration that increases with respect to deposition thickness.

8. The structure of claim 7 wherein the SiGe vertical optical path has an X concentration of Ge at the normal feature wall interface, a Y concentration of Ge at a SiGe optical path normal structure surface, where Y>X, 0≦X≦0.3, and Y≦1, and the SiGe deposition thickness is in the range of 0.1 to 1 microns.

9. The structure of claim 1 wherein the SiGe vertical optical path includes a plurality of SiGe layers, where a Si layer is interposed between SiGe layers.

10. The structure of claim 2 wherein the Si substrate is included in a silicon-on-insulator (SOI) material that further includes a buried oxide (BOX) layer overlying the Si substrate, and a top Si layer overlying the BOX;

wherein the normal feature is a pillar formed in the top Si layer of the SOI; and,

wherein the dielectric layer overlying the Si substrate surface is BOX.

11. The structure of claim 10 wherein the top Si layer overlying the BOX has a thickness in the range of 0.1 to 2 microns.

12. The structure of claim 2 wherein the Si substrate is included in a SOI substrate, further including a BOX layer overlying the Si substrate, and a top Si layer overlying the BOX;

wherein the Si normal feature is selected from the group including a via and a trench, and formed in the top Si layer of the SOI;

wherein the dielectric layer overlying the normal feature surface is BOX.

13. The structure of claim 12 wherein the top Si layer has a thickness in the range of 0.1 to 2 microns.

14. The structure of claim 1 wherein the Si substrate is a bulk Si substrate.

15. The structure of claim 2 further comprising:

facets in the SiGe vertical optical path, adjacent the dielectric layer overlying the Si substrate and normal feature surfaces.

16. The structure of claim 1 wherein the SiGe vertical optical path is single crystal SiGe.

17. A silicon-germanium (SiGe) vertical optical path structure for infrared (IR) photodetection, the structure comprising:

a bulk Si substrate with a horizontal surface;

a Si feature, normal with respect to the Si substrate surface; and,

a SiGe vertical optical path, formed overlying the Si normal feature, normal with respect to the Si substrate surface.

18. A silicon-germanium (SiGe) vertical optical path structure for infrared (IR) photodetection, the structure comprising:

a Si substrate with a horizontal surface;

a Si feature, normal with respect to the Si substrate surface; and,

a SiGe vertical optical path, formed overlying the Si normal feature, normal with respect to the Si substrate surface, and including a plurality of SiGe layers, where a Si layer is interposed between SiGe layers.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2017
From: SHARP CORPORATION AKA SHARP KABUSHIKI KAISHA
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 044410/0751 →
NUNC PRO TUNC ASSIGNMENT Recorded Oct 10, 2016
From: SHARP LABORATORIES OF AMERICA, INC.
To: SHARP KABUSHIKI KAISHA AKA SHARP CORPORATION
Reel/Frame 039973/0934 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2010
From: SHARP LABORATORIES OF AMERICA INC.
To: SHARP KABUSHIKI KAISHA
Reel/Frame 024066/0961 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2004
From: TWEET, DOUGLAS J.; LEE, JONG-JAN; MAA, JER-SHEN; HSU, SHENG TENG
To: SHARP LABORATORIES OF AMERICA, INC.
Reel/Frame 014904/0173 →
Continuity (2)
Continuation In Part 1074695200 · Dec 23, 2003
Related Publication 20050153474A1 · Jul 14, 2005