Semiconductor device and manufacture method thereof
View Patent ↗The problem is to provide a technology to reduce a light leakage current in order to obtain a good display. One kind or plurality kinds of elements chosen from argon, germanium, silicon, helium, neon, krypton, and xenon are implanted in a crystalline semiconductor layer, to distribute crystal defects due to the aforementioned element implantation by uniform and suitable density in the semiconductor film, making recombination centers of carriers, to thereby suppress alight sensitivity without spoiling a high degree of carrier movement included in a crystalline semiconductor layer.
1. A semiconductor device comprising:
a transparent substrate;
a light shielding film provided over said transparent substrate;
a crystalline semiconductor layer provided over said light shielding film; and
crystal defects formed in the crystalline semiconductor layer,
wherein one kind or plurality kinds of elements chosen from argon, germanium, silicon, helium, neon, krypton, and xenon are included in the crystalline semiconductor layer with a concentration of 1×10 16 to 5×10 18 /cm 3 .
2. A device according to claim 1 wherein the crystal defects due to the element implantation are distributed by uniform density throughout the whole region of the semiconductor layer.
3. A semiconductor device comprising:
a transparent substrate;
a light shielding film provided over said transparent substrate;
a crystalline semiconductor layer comprising a channel region provided over said light shielding film, said semiconductor layer including metal elements with a concentration of 1×10 15 –5×10 17 /cm 3 , and at least said channel region including one kind or plurality kinds of elements chosen from silicon, argon, germanium, helium, neon, krypton, and xenon with a concentration of 1×10 6 –5×10 18 /cm 3 and
crystal defects formed in the crystalline semiconductor layer.
4. A device according to claim 3 , wherein the metal elements are either of one kind of or plurality kinds of Ni, Fe, Co, Sn, Pb, Ru, Rh, Pd, Os, Ir, Pt, Cu, and Au.
5. A semiconductor device comprising:
a transparent substrate;
a light shielding film provided over said transparent substrate:
a crystalline semiconductor layer provided over said light shielding film and including metal elements with a concentration of 1×10 15 –5×10 17 /cm 3 in the semiconductor layer, and also including one kind or plurality kinds of elements chosen from silicon, argon, germanium, helium, neon, krypton, and xenon with a concentration of 1×10 16 –5×10 18 /cm 3 the semiconductor layer.
6. A device according to claim 5 , wherein the metal elements are either of one kind of or plurality kinds of Ni, Fe, Co, Sn, Pb, Ru, Rh, Pd, Os, Ir, Pt, Cu, and Au.
7. A semiconductor device comprising:
a transparent substrate;
a light shielding film provided over said transparent substrate;
a crystalline semiconductor layer comprising a channel region provided over said light shielding film;
a source region and a drain region sandwiching said channel region;
a gate electrode provided adjacent to said channel region with a gate insulating film therebetween; and
crystal defects formed in the crystalline semiconductor layer,
wherein one kind or plurality kinds of elements chosen from argon, germanium, silicon, helium, neon, krypton, and xenon are included in the crystalline semiconductor layer with a concentration of 1×10 16 to 5×10 18 /cm 3 .
8. A device according to claim 7 wherein the crystal defects due to the element implantation are distributed by uniform density throughout the whole region of the semiconductor layer.
9. A semiconductor device comprising:
a transparent substrate;
a light shielding film provided over said transparent substrate;
a crystalline semiconductor layer comprising a channel region provided over said light shielding film;
a source region and a drain region sandwiching said channel region;
a gate electrode provided adjacent to said channel region with a gate insulating film therebetween;
crystal defects formed in the crystalline semiconductor layer; and
a light source,
wherein one kind or plurality kinds of elements chosen from argon, germanium, silicon, helium, neon, krypton, and xenon are included in the crystalline semiconductor layer with a concentration of 1×10 16 to 5×10 18 /cm 3 .
10. A device according to claim 9 wherein the crystal defects due to the element implantation are distributed by uniform density throughout the whole region of the semiconductor layer.
11. A semiconductor device comprising:
a transparent substrate;
a light shielding film provided over said transparent substrate;
a crystalline semiconductor layer comprising a channel region provided over said light shielding film;
a source region and a drain region sandwiching said channel region;
a gate electrode provided adjacent to said channel region with a gate insulating film therebetween; and
crystal defects formed in the crystalline semiconductor layer,
wherein one kind or plurality kinds of elements chosen from argon, germanium, silicon, helium, neon, krypton, and xenon are included in the channel region of the crystalline semiconductor layer with a concentration of 1×10 16 to 5×10 18 /cm 3 .
12. A device according to claim 11 wherein the crystal defects due to the element implantation are distributed by uniform density throughout the whole region of the semiconductor layer.