Electronic device
View Patent ↗The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosion resistance can be improved, and a highly reliable electronic device for car use can be provided. Further, the probing portion necessary for adjustment of the resistance and characteristics and the mounting portion for mounting parts are formed in a shape having no corners at 90° or less, for example, in a circular shape, in an elliptical shape, or in a shape that the corners of a tetragon are rounded (R) or chamfered (C).
1. An electronic device contained in a case member which is disposed in an air cleaner or an air duct of an automobile, comprising:
a substrate having electronic elements mounted thereon, and conductor wire films made of silver or silver alloys, the conductor wire films being connected to the elements;
an insulating overcoat film made of a material selected from the group consisting of glass and resin covering the surface of the device, including the conductor wire films; wherein,
the overcoat has openings through which surfaces of the conductor wire films are exposed;
the openings are formed in a shape having no square corners and no acute angle corners;
the entire exposed surfaces of the conductor wire films are covered with a solder whose main component is tin, whereby the exposed surfaces of the conductor wire films are protected from any corrosive gas that may enter the case member; and
said electronic elements and said insulating overcoat comprise thick film elements formed on said substrate.
2. An electronic device disposed in a case member placed in an air duct, comprising:
a substrate having conductor wire films made of silver or silver alloys and electronic elements mounted thereon, said electronic elements including at least one element selected from the group consisting of resistors, capacitors, inductors, and diodes, the conductor wire films being connected to the at least one element; and
an insulating overcoat film made of a material selected from the group consisting of glass and resin covering the surface of the device, including the conductor wire films; wherein
the overcoat has openings through which surfaces of the conductor wire films are exposed;
the openings are formed in a shape having no square corners and no acute angle corners;
the entire exposed surfaces of the conductor wire films are covered with a solder whose main component is tin, whereby the exposed surface of the conductor wire films are protected from any corrosive gas that may enter the case member; and
said electronic elements and said insulating overcoat comprise thick film elements formed on said substrate.
3. The electronic device according to claim 1 , wherein the openings have a shape that is selected from the group consisting of a round, elliptical, rectangular with round corners, and rectangular with chamfered corners.
4. The electronic device according to claim 1 , wherein the openings are covered with a conductive metal paste.
5. The electronic device according to claim 1 , wherein the substrate has at least two layers.
6. An electronic device for a case member disposed in an air duct of an automobile, comprising:
a substrate having conductor wire films made of silver or a silver alloy mounted thereon; and
an insulating overcoat film made of an insulating material covering the conductor wire films; wherein
the overcoat has an opening having no acute angle corner wherein a surface of the conductor wire films is exposed through an opening formed in the overcoat; and
the surface of the exposed conductor wire film is covered with a solder whose main component is tin.
7. An electronic device for a case member disposed in an air duct of an automobile, comprising:
a substrate having a resistor film mounted thereon, the resistor having conductor wire films and terminals connected thereto; and
an overcoat film made of an insulator covering the resistor, the conductor wire films, and the terminals; wherein,
the overcoat film has an opening formed in a shape having no acute angle corners wherein a surface of the conductor wire films is exposed; and
the exposed surface of the conductor wire films is covered with a solder whose main component is tin.