Cooling device, and apparatus and method for manufacturing image display panel using cooling device
A method for manufacturing an image display panel includes the steps of heating a substrate for the image display panel having a different-emissivity member on at least a part of one surface of the substrate, with the member having an emissivity different from that of the substrate, and then placing a cooling plate opposite the heated substrate to absorb radiation heat from the substrate to cool the substrate. The cooling plate has a different-emissivity area in a pattern that can suppress a temperature distribution that may be created in the substrate if the substrate is cooled using a cooling plate with a uniform emissivity, with the different-emissivity area having an emissivity different from that of other areas.
1. A method for manufacturing an image display panel, the method comprising the steps of heating a substrate for the image display panel having a different-emissivity member on at least a part of one surface of the substrate, the member having an emissivity different from that of the substrate, and then placing a cooling plate opposite the heated substrate to absorb radiation heat from the substrate to cool the substrate, wherein the cooling plate has a different-emissivity area in a pattern that can suppress a temperature distribution that may be created in the substrate if the substrate is cooled using a cooling plate with a uniform emissivity, the different-emissivity area having an emissivity different from that of other areas.
2. The method for manufacturing an image display panel according to claim 1 , wherein the different-emissivity member is wiring having a lower emissivity than the substrate, and the different-emissivity area of the cooling plate is provided substantially in association with an area in which the wiring is formed, and has a higher emissivity than the other areas.
3. The method for manufacturing an image display panel according to claim 2 , wherein the substrate has a spacer provided on one surface together with the wiring, the spacer projecting from the one surface, and the cooling plate on which the different-emissivity area is formed is located on the other surface of the substrate.