Method and apparatus for forming a pattern, device and electronic apparatus
A method for forming a pattern on a substrate, including the steps of: ejecting liquid drops from an ejection head having nozzles onto a reference plate on which a plurality of target positions are defined, the target positions being arranged in at least one row; detecting an amount of a displacement between the target positions and the positions at which the liquid drops have actually landed; determining a relative positional error relative to the ejection head for each of the at least one row of the target positions based on the amount of the displacement; determining a correction value for each of the at least one row based on the relative positional error; and sequentially changing a relative position of the substrate and the ejection head based on the corrections values when the liquid drops are being ejected onto the substrate.
1. A method for forming a pattern on a substrate, comprising the steps of:
ejecting liquid drops from an ejection head having nozzles onto a reference plate on which a plurality of blocks are defined, a plurality of target positions being defined in each block, the target positions being arranged in a plurality of rows in a predetermined pattern;
detecting an amount of a displacement between the target positions and the positions at which the liquid drops have actually landed; determining a relative positional error relative to the ejection head for each of the plurality of rows of the target positions based on the amount of the displacement; determining a correction value for each of the plurality of rows based on the relative positional error; and sequentially changing a relative position of the substrate and the ejection head based on the correction values while ejecting the liquid drops onto the substrate, wherein the target positions are based on a plurality of marks formed on the reference plate; and wherein a spacing between the target positions in a first direction is approximately twice a spacing between nozzle holes of the ejection head.
2. A device that is manufactured using the method for forming a pattern on a substrate according to claim 1 .
3. The method according to claim 1 , wherein the marks are of approximately the same size as that of the liquid drops ejected on the reference plate from the ejection head.
4. The method according to claim 1 , wherein the predetermined pattern is a polka dot pattern.