Optical transceiver
View Patent ↗An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.
1. An optical transceiver, comprising:
an optical subassembly that comprises:
(i) a built-in chip portion that comprises a chip for light transmission and reception; and
(ii) a receptacle portion that extends from a first end of the built-in chip portion and defines an optical path; wherein the built-in chip portion and the receptacle portion are attached to each other;
a board electrically connected via a lead at an end of the board to a second end of the built-in chip portion that is opposite to the first end of the built-in chip portion;
a housing that houses the optical subassembly and the board; and
a holding member that comprises a front rib comprising a groove into which the receptacle portion is fitted, a back rib to which the board is secured, and a side rib that links the front rib and the back rib;
wherein the holding member includes a bottom face that includes an aperture;
wherein the holding member accommodates and fixes the optical subassembly;
wherein the board and the back rib of the holding member are securely fixed to each other by a fixing member in a vicinity of the end of the board connected to the lead; and
wherein the housing is provided with passages through which an optical fiber connector is inserted.
2. The optical transceiver according to claim 1 , wherein:
the aperture of the holding member is larger than the built-in chip portion of the optical subassembly.
3. The optical transceiver according to claim 1 , wherein:
the holding member has a frame structure.
4. The optical transceiver according to claim 1 , wherein:
the ribs of the holding member form an arm structure with one side opened.
5. An optical transceiver, comprising:
an optical subassembly that comprises:
(i) a built-in chip portion that comprises a chip for light transmission and reception; and
(ii) a receptacle portion that extends from a first end of the built-in chip portion and defines an optical path; wherein the built-in chip portion and the receptacle portion are attached to each other;
a board electrically connected to a second end of the built-in chip portion that is opposite to the first end of the built-in chip portion;
a housing that houses the optical subassembly and the board; and
a holding member that comprises a front rib comprising a groove into which the receptacle portion is fitted, a back rib to which the board is secured, and a side rib that links the front rib and the back rib;
wherein the holding member includes a bottom face that includes an aperture;
wherein the optical subassembly and the board are securely fixed to the holding member, and
wherein the housing comprises a front restriction portion to restrict a forward movement of the front rib in a direction of an axis of the optical path, and a back restriction portion to restrict a backward movement of the back rib in the direction of the axis of the optical path.
6. The optical transceiver according to claim 5 , wherein:
the housing further comprises a heat radiation sheet disposed on a predetermined inside face of the housing,
the optical subassembly comprises a predetermined face that is at the same level as the bottom face of the holding member or protrudes through the aperture of the bottom face of the holding member, and
the predetermined face of the optical subassembly is in contact with the heat radiation sheet.
7. The optical transceiver according to claim 6 , wherein:
the housing further comprises a stopper to prevent the optical subassembly from shifting in excess of a predetermined distance.
8. The optical transceiver according to claim 5 , further comprising:
a shield member that is disposed between the front restriction portion of the housing and the front rib of the holding member,
wherein the shield member comprises an elastic material.
9. An optical transceiver, comprising:
an optical subassembly that comprises:
(i) a built-in chip portion that comprises a chip for light transmission and reception; and
(ii) a receptacle portion that extends from a first end of the built-in chip portion and defines an optical path; wherein the built-in chip portion and the receptacle portion are attached to each other;
a board electrically connected to a second end of the built-in chip portion that is opposite to the first end of the built-in chip portion;
a housing that houses the optical subassembly and the board; and
a holding member that comprises a front rib comprising a groove into which the receptacle portion is fitted, a back rib to which the board is secured, and a side rib that links the front rib and the back rib;
wherein the holding member includes a bottom face that includes an aperture,
wherein the optical subassembly and the board are securely fixed to the holding member,
wherein the housing further comprises a heat radiation sheet disposed on a predetermined inside face of the housing,
wherein the optical subassembly comprises a predetermined face that is at the same level as the bottom face of the holding member or protrudes through the aperture of the bottom face of the holding member, and
wherein the predetermined face of the optical subassembly is in contact with the heat radiation sheet.
10. The optical transceiver according to claim 9 , wherein:
the housing further comprises a stopper to prevent the optical subassembly from shifting in excess of a predetermined distance.
11. An optical transceiver, comprising:
an optical subassembly that comprises:
(i) a built-in chip portion that comprises a chip for light transmission and reception; and
(ii) a receptacle portion that extends from a first end of the built-in chip portion and defines an optical path; wherein the built-in chip portion and the receptacle portion are attached to each other;
a board electrically connected to a second end of the built-in chip portion that is opposite to the first end of the built-in chip portion;
a housing that houses the optical subassembly and the board; and
a holding member that comprises a front rib comprising a groove into which the receptacle portion is fitted, a back rib to which the board is secured, and a side rib that links the front rib and the back rib;
wherein the holding member holds the optical subassembly;
wherein the housing further comprises a heat radiation sheet disposed on a predetermined inside face of the housing;
wherein the optical subassembly comprises a predetermined face that is at the same level as an outside face of the holding member or protrudes from the outside face of the holding member;
wherein the predetermined face of the optical subassembly is in contact with the heat radiation sheet;
wherein the optical subassembly is connected through a lead to the board, and
wherein the lead has a shift quantity of ±0.1 mm or less in a direction of a thickness of the heat radiation sheet between a reference position of the lead expected when the optical subassembly is at a reference position and a position of the lead in a mounted state where the optical subassembly, the board and the holding member are mounted on the housing; and
wherein the reference position of the optical subassembly is defined as a position where the optical subassembly is targeted to sit after being mounted and after being shifted by a predetermined distance in a direction that the heat radiation sheet is compressed from its original thickness.
12. An optical transceiver, comprising:
an optical subassembly that comprises a built-in chip portion and a receptacle portion;
a board electrically connected via a lead at an end of the board to one end of the built-in chip portion;
a housing that houses the optical subassembly and the board, wherein the housing comprises a bottom plate, wherein the housing is provided with passages through which an optical fiber connector is inserted; and
a holding member to hold the optical subassembly, wherein the holding member is disposed separately on the bottom plate of the housing; and
wherein the holding member accommodates and fixes the optical subassembly; and
wherein the board and a back rib of the holding member are securely fixed to each other by a fixing member in a vicinity of the end of the board connected to the lead.
13. The optical transceiver according to claim 12 , wherein:
the holding member includes a bottom face that includes an aperture.
14. An optical transceiver, comprising:
an optical subassembly that comprises a built-in chip portion and a receptacle portion;
a board electrically connected to one end of the built-in chip portion;
a housing that houses the optical subassembly and the board, wherein the housing comprises a bottom plate; and
a holding member to hold the optical subassembly, wherein the holding member is disposed separately on the bottom plate of the housing;
wherein the optical subassembly and the board are securely fixed to the holding member,
wherein the holding member comprises a front rib comprising a groove into which the receptacle portion is fitted and a back rib to which the board is secured, and
wherein the housing comprises a front restriction portion to restrict a forward movement of the front rib in a longitudinal direction of the optical transceiver and a back restriction portion to restrict a backward movement of the back rib in the longitudinal direction of the optical transceiver.
15. A method for assembling an optical transceiver, comprising the steps of:
integrating a built-in chip portion that comprises a chip for light transmission and reception and a receptacle portion that defines an optical path into an optical subassembly;
securely fixing the optical subassembly to a holding member, wherein the holding member comprises a front rib, a back rib, and a side rib that links the front rib and the back rib to accommodate the optical subassembly;
securely fixing a board to the back rib of the holding member by a fixing member in a vicinity of an end of the board;
electrically connecting the optical subassembly to the board via a lead at the end of the board attached by the fixing member; and
attaching the optical subassembly, holding member, and board inside a housing, wherein said housing comprises a top plate, a side plate, and a bottom plate, wherein the housing is provided with passages through which an optical fiber connector is inserted.
16. The method according to claim 15 , wherein the step of securely fixing the board to the back rib of the holding member comprises the step of disposing the board on the back rib of the holding member and securing the board to the back rib with a screw.
17. The method according to claim 15 , wherein the step of electrically connecting the optical subassembly to the board comprises soldering the lead protruding from the optical subassembly to the board.
18. The method according to claim 15 , further comprising the step of: disposing a heat radiation sheet on the bottom plate of the housing, wherein the heat radiation sheet is disposed between the bottom plate of the housing and a bottom surface of the holding member.
19. A method for assembling an optical transceiver, comprising the steps of:
integrating a built-in chip portion that comprises a chip for light transmission and reception and a receptacle portion that defines an optical path into an optical subassembly;
securely fixing the optical subassembly to a holding member, wherein the holding member comprises a front rib, a back rib, and a side rib that links the front rib and the back rib;
securely fixing a board to the back rib of the holding member; and
attaching the optical subassembly, holding member, and board inside a housing, wherein said housing comprises a top plate, a side plate, and a bottom plate;
wherein the top plate of the housing comprises a bottom side; and
wherein the step of attaching comprises the step of attaching the optical subassembly to the bottom side of the top plate of the housing.
20. The method according to claim 19 , wherein the step of attaching further comprises the step of:
closing up the optical subassembly and holding member within the housing by attaching the bottom plate of the housing to the top plate of the housing.
21. A method for assembling an optical transceiver, comprising the steps of:
integrating a built-in chip portion that comprises a chip for light transmission and reception and a receptacle portion that defines an optical path into an optical subassembly;
securely fixing the optical subassembly to a holding member, wherein the holding member comprises a front rib, a back rib, and a side rib that links the front rib and the back rib;
securely fixing a board to the back rib of the holding member; and
attaching the optical subassembly, holding member, and board inside a housing, wherein said housing comprises a top plate, a side plate, and a bottom plate;
wherein the step of securely fixing the optical subassembly to a holding member comprises the steps of:
fitting the receptacle portion into a bottom half of the front rib; and
laying a top half of the front rib onto the bottom half of the front rib wherein the optical subassembly is held by the holding member.