IP Library Granted Patent US 7,371,013
Granted Patent B2
US 7,371,013 · App. 11/384,504 · Granted May 13, 2008

Laser apparatus and methods for assembling and installing the same

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Quick Facts
Patent No.
US 7,371,013
App. No.
11/384,504
Granted
May 13, 2008
Kind
B2
Abstract

A method for assembling a laser apparatus which condenses a laser beam and couples the laser beam to an optical fiber. After the optical fiber is fixed to a package, the whole or a part of an optical condensing system is fixed to the package through a fixing structure having at least one guide surface extending in at least one of first and second directions respectively parallel and perpendicular to the core axis of the optical fiber, by moving the whole or the part of the optical condensing system along the at least one guide surface to a predetermined position with respect to the core axis, and fixing the whole or the part of the optical condensing system to the fixing structure at the predetermined position.

Claims (59)

1. A laser apparatus comprising:

one or more semiconductor lasers which emit one or more laser beams;

an optical fiber;

an optical condensing system which condenses said one or more laser beams emitted from said one or more semiconductor lasers, and makes the one or more laser beams enter said optical fiber from a light-entrance end of the optical fiber;

a package which contains said optical condensing system and said one or more semiconductor lasers, and fixedly holds said optical fiber in such a manner that said light-entrance end faces said optical condensing system; and

a fixing structure which is arranged between said optical condensing system and said package for fixing the whole or a part of the optical condensing system to the package, which has at least one guide surface extending in at least one of first and second directions respectively parallel and perpendicular to a core axis of the optical fiber at said light-entrance end, and which allows sliding movement of the whole or said part of the optical condensing system along the guide surface before fixing the whole or said part of the optical condensing system to the package,

wherein said fixing structure comprises,

a mount which has a holder-attachment surface perpendicular to said core axis, and is fixed to said package, and

a holder which has an optical-system mounting surface arranged parallel to said core axis for mounting the whole or said part of the optical condensing system, and is fixed to said holder-attachment surface; and

wherein the optical condensing system and the holder have respective reference surfaces each of which has an arithmetic average roughness Ra of less than 0.08 micrometers.

2. A laser apparatus according to claim 1 , wherein said one or more semiconductor lasers emit a plurality of laser beams.

3. A laser apparatus according to claim 1 , wherein said optical fiber is fixed to said package with one of a brazing material and an adhesive.

4. A laser apparatus according to claim 1 , further comprising a ferrule which is arranged for fixing said optical fiber, and is integral with the package.

5. A laser apparatus according to claim 1 , wherein said holder has a front face and a rear face which are parallel to each other with a precision of approximately ±15″.

6. A laser apparatus according to claim 1 , wherein the optical condensing system and said holder have respective adhesion surfaces that have an arithmetic average roughness Ra in the range of 0.15 to 0.35 micrometers.

7. A laser apparatus according to claim 1 , wherein the holder is made of glass.

8. A laser apparatus according to claim 1 , wherein said fixing structure has a first guide surface, extending in the direction of the core axis, and a second guide surface extending in the direction perpendicular to the direction of the core axis, said first and second guide surfaces being formed by different members.

9. A method for assembling a laser apparatus having,

one or more semiconductor lasers which emit one or more laser beams,

an optical fiber,

an optical condensing system which condenses said one or more laser beams emitted from said one or more semiconductor lasers, and makes the one or more laser beams enter said optical fiber from a light-entrance end of the optical fiber,

a package which contains said optical condensing system and said one or more semiconductor lasers, and fixedly holds said optical fiber in such a manner that said light-entrance end faces said optical condensing system, and

a fixing structure which is arranged between said optical condensing system and said package for fixing the whole or a part of the optical condensing system to the package through the fixing structure, which has at least one guide surface extending in at least one of first and second directions respectively parallel and perpendicular to a core axis of the optical fiber at said light-entrance end, and which allows movement of the whole or said part of the optical condensing system along the at least one guide surface before fixing the whole or said part of the optical condensing system to the package,

wherein said fixing structure comprises,

a mount which has a holder-attachment surface perpendicular to said core axis, and is fixed to said package, and

a holder which has an optical-system mounting surface arranged parallel to said core axis for mounting the whole or said part of the optical condensing system, and is fixed to said holder-attachment surface; and

wherein the optical condensing system and the holder have respective reference surfaces each of which has an arithmetic average roughness Ra of less than 0.08 micrometers. said method comprising the steps of:

(a) fixing said optical fiber to said package;

(b) adjusting the whole or said part of the optical condensing system to a predetermined position with respect to said core axis by sliding the whole or said part of the optical condensing system along said at least one guide surface of said fixing structure; and

(c) fixing the whole or said part of the optical condensing system to said fixing structure at said predetermined position.

10. A method for assembling a laser apparatus having,

one or more semiconductor lasers which emit one or more laser beams,

an optical fiber,

an optical condensing system which condenses said one or more laser beams emitted from said one or more semiconductor lasers, and makes the one or more laser beams enter said optical fiber from a light-entrance end of the optical fiber,

a package which contains said optical condensing system and said one or more semiconductor lasers, and fixedly holds said optical fiber in such a manner that said light-entrance end faces said optical condensing system, and

a fixing structure including,

a mount which has a holder-attachment surface perpendicular to said core axis, and is fixed to said package, and

a holder which has an optical-system mounting surface arranged parallel to said core axis for mounting the whole or a part of the optical condensing system, and is fixed to said holder-attachment surface,

wherein the optical condensing system and the holder have respective reference surfaces each of which has an arithmetic average roughness Ra of less than 0.08 micrometers.

said method comprising the steps of

(a) fixing said optical fiber to said package;

(b) adjusting said holder to a first predetermined position in a first direction perpendicular to said core axis by sliding the holder on said holder-attachment surface of said mount fixed to said package;

(c) fixing said holder to said holder-attachment surface at said first predetermined position;

(d) adjusting the whole or said part of the optical condensing system to a second predetermined position in a second direction parallel to said core axis by sliding the whole or said part of the optical condensing system on said optical-system mounting surface of said holder fixed to said mount; and

(e) fixing the whole or said part of the optical condensing system to said optical-system mounting surface at said second predetermined position.

11. An installation structure for installing a laser apparatus having a package, in a system using the laser apparatus and having a main body, comprising:

a package-mounting member having a mounting surface on which said package is placed, and being directly or indirectly fixed to said main body; and

an elastic member elastically pressing said package against the mounting surface;

wherein said laser apparatus includes,

one or more semiconductor lasers which emit one or more laser beams,

an optical fiber,

an optical condensing system which condenses said one or more laser beams emitted from said one or more semiconductor lasers, and makes the one or more laser beams enter said optical fiber from a light-entrance end of the optical fiber,

said package which contains said optical condensing system and said one or more semiconductor lasers, and fixedly holds said optical fiber in such a manner that said light-entrance end faces said optical condensing system, and

a fixing structure which is arranged between said optical condensing system and said package for fixing the whole or a part of the optical condensing system to the package through the fixing structure, which has at least one guide surface extending in at least one of first and second directions respectively parallel and perpendicular to a core axis of the optical fiber at said light-entrance end, and which allows sliding movement of the whole or said part of the optical condensing system along the at least one guide surface before fixing the whole or said part of the optical condensing system to the package,

wherein said fixing structure comprises,

a mount which has a holder-attachment surface perpendicular to said core axis, and is fixed to said package, and

a holder which has an optical-system mounting surface arranged parallel to said core axis for mounting the whole or said part of the optical condensing system, and is fixed to said holder-attachment surface; and

wherein the optical condensing system and the holder have respective reference surfaces each of which has an arithmetic average roughness Ra of less than 0.08 micrometers.

12. An installation structure according to claim 11 , wherein said package-mounting member has a temperature-control function which realizes temperature control of said laser apparatus, and said package is placed in direct contact with said mounting surface without insertion of a heat-insulating member.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2014
From: FUJIFILM CORPORATION
To: ADTEC ENGINEERING CO., LTD.
Reel/Frame 032163/0521 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2006
From: NAGANO, KAZUHIKO; TERAMURA, YUICHI; HASHIGUCHI, AKIHIRO
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 017702/0369 →