Nanoparticle-based power coatings and corresponding structures
Methods are described that have the capability of producing submicron/nanoscale particles, in some embodiments dispersible, at high production rates. In some embodiments, the methods result in the production of particles with an average diameter less than about 75 nanometers that are produced at a rate of at least about 35 grams per hour. In other embodiments, the particles are highly uniform. These methods can be used to form particle collections and/or powder coatings. Powder coatings and corresponding methods are described based on the deposition of highly uniform submicron/nanoscale particles.
1. A substrate comprising a powder coating comprising an inorganic composition, the powder coating comprising primary particles having an average particle size less than about 500 nm and effectively no primary particles having a diameter greater than about 4 times the average primary particle diameter wherein the powder coating has an approximately uniform thickness across at least a portion of a substrate surface and wherein the powder coating forms a porous network of fused inorganic particles wherein the powder coating has a thickness from about 50 nm to about 500 microns.
2. The substrate of claim 1 wherein the average primary particle size is less than about 100 nm.
3. The substrate of claim 1 wherein the average primary particle size is less than about 50 nm.
4. The substrate of claim 1 wherein effectively no primary particles have a diameter greater than about 3 times the average primary particle diameter.
5. The substrate of claim 1 wherein effectively no primary particles have a diameter greater than about 2 times the average primary particle diameter.
6. The substrate of claim 1 wherein the primary particles have a distribution in diameters with at least about 95 percent of the primary particles having a diameter greater than about 40 percent of the average diameter and less than about 225 percent of the average diameter.
7. The substrate of claim 1 wherein the primary particles have a distribution of diameters with at least about 95 percent of the primary particles having a diameter greater than about 45 percent of the average diameter and less than about 200 percent of the average diameter.
8. The substrate of claim 1 wherein the particles comprise silicon oxide.
9. The substrate of claim 1 wherein the particles comprise a metal oxide.
10. The substrate of claim 9 wherein the metal oxide comprises a rare earth metal.
11. The substrate of claim 1 wherein the particles comprise a plurality of metalloid compounds.
12. The substrate of claim 1 wherein the particles comprise a plurality of metal compounds.
13. The substrate of claim 1 wherein powder coating has a thickness of no more than about 250 microns.
14. The substrate of claim 1 wherein the powder coating has a thickness from about to about 100 nanometers to about 50 microns.
15. The substrate of claim 1 having approximately a uniform thickness across the powder coating.
16. The substrate of claim 1 wherein the powder coating has a different thickness along different portions of the substrate.
17. The substrate of claim 16 wherein the substrate comprises silicon.
18. The substrate of claim 1 having a density less than about 0.6 times the density of the fully densified material of the powder coating.
19. The substrate of claim 1 having a density from about 0.05 to about 0.4 times the density of the fully densified material of the powder coating.
20. A device comprising the substrate of claim 1 .
21. The substrate of claim 1 wherein the coating is smooth.
22. The substrate of claim 1 wherein the coating is on a silicon wafer.
23. The substrate of claim 1 wherein the coating is on a substrate comprising fused silica, quartz, alumina, lithium tantalate, lithium, niobate, gallium arsenide, indium phosphide, soda-lime silicate glass, borosilicate glass, and aluminosilicate glass.
24. The substrate of claim 1 wherein the coating is patterned on the substrate.
25. The substrate of claim 1 wherein the coating is on a planar surface of the substrate.
26. The substrate of claim 1 wherein the particles comprise a metal/metalloid oxide, a metal/metalloid nitride, a metal/metalloid carbide, a metal/metalloid sulfide or a combination thereof.
27. The substrate of claim 1 wherein the particles comprise a metal/metalloid arsinide, a metal/metalloid phosphide, a metal/metalloid selenide, a metal/metalloid telluride or a combination thereof.
28. The substrate of claim 1 wherein the particles comprise a dopant.