Structured surfaces with controlled flow resistance
View Patent ↗An apparatus comprising a substrate having a surface configured to accommodate a fluid thereover. A plurality of fluid-support-structures are on the surface. Each of the fluid-support-structures has at least one dimension of less than one millimeter. A well in the substrate has an opening on the surface. A medium is locatable between the plurality of fluid-support-structures and in the well. The medium located between the fluid-support-structures is in communication with the medium in the well.
1. An apparatus comprising:
a substrate having a surface configured to accommodate a fluid thereover, wherein said surface comprises:
a plurality of fluid-support-structures on said surface, each of said fluid-support-structures having at least one dimension of less than one millimeter; and
a well in said substrate, wherein said well has an opening on said surface;
wherein said fluid-support-structures and said well are configured to allow a medium to communicate between said fluid-support-structures and said well, when said fluid contacts said fluid-support-structures, and
wherein said surface is an interior surface of a channel configured to transport said fluid.
2. An apparatus comprising:
a substrate having a surface configured to accommodate a fluid thereover, wherein said surface comprises:
a plurality of fluid-support-structures on said surface, each of said fluid-support-structures having at least one dimension of less than one millimeter; and
a well in said substrate, wherein said well has an opening on said surface;
wherein said fluid-support-structures and said well are configured to allow a medium to communicate between said fluid-support-structures and said well, when said fluid contacts said fluid-support-structures, and,
wherein said surface is located on an exterior surface of a body configured to move through said fluid.
3. The apparatus of claim 2 , wherein at least one lateral dimension of said well is less than a capillary length of said fluid.
4. The apparatus of claim 2 , wherein at least one lateral dimension of said well is from about 10 to about 100 times greater than a separation between adjacent ones of said fluid-support-structures.
5. The apparatus of claim 2 , wherein said substrate comprises an insulating layer located between an upper conductive layer and a lower conductive layer, and an electrical source configured to apply a voltage between said upper and lower conductive layer.
6. A method, comprising:
controlling a flow resistance of a fluid disposed on a surface of a substrate, comprising:
contacting said fluid with a plurality of fluid-support-structures on said surface, each of said fluid-support-structures having at least one dimension of less than one millimeter and a medium located there-between, thereby forming a medium-fluid interface; and
communicating said medium between said fluid-support-structures and a well in said substrate, thereby stabilizing a location of said medium-fluid interface over said surface, wherein said communicating includes diffusing gas from between said fluid and said well.
7. A method, comprising:
controlling a flow resistance of a fluid disposed on a surface of a substrate, comprising:
contacting said fluid with a plurality of fluid-support-structures on said surface, each of said fluid-support-structures having at least one dimension of less than one millimeter and a medium located there-between, thereby forming a medium-fluid interface; and
communicating said medium between said fluid-support-structures and a well in said substrate, thereby stabilizing a location of said medium-fluid interface over said surface, wherein said communicating includes electrolytically generating additional medium in said well.
8. A method, comprising:
controlling a flow resistance of a fluid disposed on a surface of a substrate, comprising:
contacting said fluid with a plurality of fluid-support-structures on said surface, each of said fluid-support-structures having at least one dimension of less than one millimeter and a medium located there-between, thereby forming a medium-fluid interface; and
communicating said medium between said fluid-support-structures and a well in said substrate, thereby stabilizing a location of said medium-fluid interface over said surface, wherein said controlling is done while transporting said fluid through a channel having an interior surface having said fluid-support-structures and said well.
9. A method, comprising:
controlling a flow resistance of a fluid disposed on a surface of a substrate, comprising:
contacting said fluid with a plurality of fluid-support-structures on said surface, each of said fluid-support-structures having at least one dimension of less than one millimeter and a medium located there-between, thereby forming a medium-fluid interface; and
communicating said medium between said fluid-support-structures and a well in said substrate, thereby stabilizing a location of said medium-fluid interface over said surface, wherein said controlling is done while moving a body through said fluid, said body having an exterior surface having said fluid-support-structures and said well.