Inkjet nozzle arrangement with annular heater element
View Patent ↗This invention provides for an inkjet printhead having an array of micro-electromechanical nozzles arrangements. Each nozzle arrangement includes side walls located on a wafer substrate with a roof layer deposited on said walls to define an ink chamber, with the roof layer defining a nozzle aperture. The nozzle arrangement also includes an inlet defined in the substrate to supply the ink chamber with printing fluid. Further includes is at least one heater element having a mass of less than 10 nanograms suspended between the side walls in the chamber, so that when electrical actuation energy of less than 500 nanojoules is applied to the heater element, a vapour bubble is formed in the fluid leading to a pressure increase in the chamber thereby ejecting the fluid via the nozzle aperture. The heater element has an annular shape with a point of collapse of the bubble near a centre thereof.
1. An inkjet printhead having an array of micro-electromechanical nozzles arrangements each comprising:
side walls located on a wafer substrate with a roof layer deposited on said walls to define an ink chamber, the roof layer defining a nozzle aperture;
an inlet defined in the substrate to supply the ink chamber with printing fluid; and
at least one heater element having a mass of less than 250 picograms suspended between the side walls in the chamber, so that when electrical actuation energy of less than 120 nanojoules is applied to the heater element, a vapour bubble is formed in the fluid leading to a pressure increase in the chamber thereby ejecting the fluid via the nozzle aperture, said heater element having an annular shape with a point of collapse of the bubble near a centre thereof.
2. The printhead of claim 1 , wherein the heater element has two opposite sides and is configured such that said vapor bubble formed by the heater element is formed at both of said sides of the heater element.
3. The printhead of claim 1 , wherein the heater element is substantially covered by a conformal protective coating applied to all sides of the heater element simultaneously such that the coating is seamless.
4. The printhead of claim 1 , wherein the fluid inlet is 200 to 300 microns in length and 8 to 24 microns in diameter.
5. The printhead of claim 1 , having a nozzle density of more than 10,000 nozzles per square cm of substrate surface.
6. The printhead of claim 1 , wherein the nozzle arrangements are formed by chemical vapor deposition (CVD).
7. The printhead of claim 1 , wherein the nozzle arrangement includes a CMOS driving layer deposited in the wafer substrate for electrically driving the heater element.