Curable resin composition, curable film and cured film

1. A curable resin composition consisting of a high molecular weight compound having a weight average molecular weight of 70,000 to 300,00 and a vinyl compound of the formula (1),

wherein the high molecular weight compound is at least one compound selected from the group consisting of a styrene isoprene styrene copolymer, a hydrogenated styrene butadiene styrene copolymer, a hydrogenated styrene isoprene styrene copolymer and a hydrogenated styrene (butadiene/isoprene) styrene copolymer, wherein the styrene content in the high molecular weight compound is from 20 to 65% by weight and the weight ratio of the vinyl compound of the formula (1): the high molecular weight compound is 30:70 to 70:30,

R 1 , R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group or a halogenated alkyl group,

—(O—X—O)— represents a moiety of the formula (2) or the formula (3) or represents at least two kinds of moieties of the formula (2) and/or the formula (3),

in which R 8 , R 9 , R 10 , R 14 and R 15 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and R 11 , R 12 and R 13 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group,

in which R 16 , R 17 , R 22 and R 23 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, R 18 , R 19 , R 20 and R 21 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and A is a linear, branched or cyclic hydrocarbon having 20 or less carbon atoms,

—(Y—O)— represents a moiety of the formula (4) or a random arrangement of at least two kinds of moieties of the formula (4),

in which R 24 and R 25 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and R 26 and R 27 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group,

Z represents an organic group having at least one carbon atom which may contain an oxygen atom, a nitrogen atom, a sulfur atom and/or a halogen atom,

each of a and b is an integer of from 0 to 30, provided that at least one of a and b is not 0, and each of c and d is an integer of 0 or 1.

2. A curable resin composition according to claim 1 , wherein —(O—X—O)— is a moiety of the formula (5) or the formula (6) and —(Y—O)— is a moiety of the formula (7) or the formula (8) or a random arrangement of moieties of the formula (7) and the formula (8),

in which R 18 and R 21 represent a hydrogen atom or a methyl group and A is a linear, branched or cyclic hydrocarbon having 20 or less carbon atoms,

3. A curable resin composition according to claim 1 , wherein the vinyl compound of the formula (1) has a number average molecular weight of from 500 to 3,000.

4. A curable film obtained by processing the curable resin composition recited in claim 1 into a film form.

5. A curable film according to claim 4 , which has a conductor layer on at least one surface thereof.

6. A film obtained by curing the curable film recited in claim 4 .

7. A film obtained by curing the curable film recited in claim 5 .