Encapsulated electrical component and production method

1. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:

producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site;

connecting, via bumps, a plurality of chips to the panel at installation sites, at least one of the plurality of chips having a back side containing active components; and

using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips;

wherein a fluid and curable resin, a melted polymer, or a dispersion containing nanoparticles is used to produce the jet-printed structure.

2. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:

producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site;

connecting, via bumps, a plurality of chips to the panel at the installation site, at least one of the plurality of chips having a back side containing active components; and

using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips;

wherein a fluid and curable resin is printed as a dispersion containing nanoparticles to produce the jet-printed structure.

3. The method of claim 1 or 2 , further comprising:

separating the MEMs component from other MEMs components by cutting the panel.

4. The method according to claim 1 , wherein the melted polymer comprises a UV-curing polymer.

5. The method of claim 1 or 2 , further comprising:

before applying the jet-printed structure, modifying surface energy of surfaces coming into contact with the jet-printed structure such that the jet-printed structure does not wet the surfaces coming into contact with the jet-printed structure.

6. The method of claim 5 , further comprising:

applying, to the surfaces coming into contact with the jet-printed structure, a film comprising a non-wetting surface, the film having a thickness of one or a more molecules.

7. The method of claim 6 , further comprising

treating the surfaces coming into contact with the jet-printed structure with a plasma containing fluorine.

8. The method of claim 6 , further comprising:

treating the surfaces coming into contact with the jet-printed structure with an organosilicon solution.

9. The method of claim 1 or 2 , further comprising:

after connecting the plurality of chips and applying the jet-printed structure, applying a base metallization to the panel by sputtering, CVD, PECVD, vapor deposition, or a thin-film process; and

reinforcing the base metallization by depositing a metal layer using solution.

10. The method of claim 1 or 2 , wherein the jet-printing process is performed under exposure to UV.

11. The method of claim 1 or 2 , further comprising:

applying a cast frame to the panel, the cast frame being applied under UV exposure during the jet-printing process; and

producing a cover layer on the component by applying a polymer inside the cast frame without simultaneous UV exposure, wherein the polymer flows inside the cast frame and is thereafter cured.

12. The method of claim 1 or 2 , further comprising:

applying a base metallization to the panel;

covering the base metallization with a polymer mask such than an annularly closed strip of the base metallization remains uncovered

reinforcing the base metallization in an area of the annular strip by metal deposition from a solution to thereby produce a metallic frame structure; and

removing the polymer mask prior to connecting a plurality of chips to the panel.

13. The method of claim 12 , wherein the metallic frame structure has a height that is at least half a height of the bumps.

14. The method of claim 1 or 2 , further comprising:

before connecting the plurality of chips, producing a frame structure on the panel, the frame structure comprising ceramic or metal and having a spacing away from a lower edge of at least one of the plurality of chips; and

sealing the frame structure via the jet-printing process after connecting the plurality of chips.

15. The method of claim 1 or 2 , further comprising:

applying, to the panel, a base metallization comprising an adhesion layer comprising titanium and a copper layer; and

enhancing a thickness of the base metallization via non-current deposition using copper and nickel.

16. The method of claim 15 , further comprising:

applying a lamination film before applying the base metallization; and

removing the lamination film in a strip-shaped area around at least one of the plurality of chips.

17. The method of claim 1 or 2 , further comprising:

producing a polymer layer on a back side of at least one of the plurality of chips; and

depositing a metal layer over the polymer layer, the metal layer comprising a hermetic cover layer.

18. The method of claim 1 or 2 , wherein polymer structures having a height between 20 μm and 30 μm height are produced in a single pass of the jet-printing process.