Electromagnetic radiation shield for an optical subassembly
View Patent ↗In one example embodiment, an electromagnetic radiation (EMR) shield includes a disk, and a substantially centrally located opening defined in the disk. An outside perimeter of the disk is approximately the same as that of a flange of an associated optical subassembly (OSA). The disk defines a plurality of apertures.
1. An EMR shield comprising:
a base defining a plurality of apertures;
first and second disks extending from the base, each disk defining a plurality of apertures, an outside perimeter of the first disk being approximately the same as that of a flange of an associated OSA; and
an opening defined by and extending through the first disk, the base, and the second disk.
2. The EMIR shield as recited in claim 1 , wherein the base, the first disk, and the second disk are composite components formed from identical top and bottom pieces that comprise stamped stainless steel sheet metal.
3. An OSA comprising:
a receptacle;
a neck extending from the receptacle;
a flange extending from the neck;
a barrel extending from the flange, the barrel defining a cavity, the cavity having a diameter; and
the EMR shield as recited in claim 1 , wherein the first disk is at least partially embedded in the flange, the second disk is at least partially embedded in the receptacle, the base is at least partially embedded in the neck, and a diameter of the opening is smaller than the diameter of the cavity.
4. The OSA as recited in claim 3 , wherein the receptacle, neck, flange, and barrel comprise an injected optically transmissive plastic material, wherein a portion of the plastic material is positioned within the apertures.
5. The OSA as recited in claim 3 , further comprising an indentation defined in the first disk.
6. The OSA as recited in claim 5 , wherein an innermost end of the cavity extends beyond the barrel into the flange and the indentation is positioned proximate the innermost end of the cavity.
7. An optoelectronic module comprising:
a housing;
a printed circuit board (PCB) at least partially positioned within the housing; and
the OSA as recited in claim 1 at least partially positioned within the housing and electrically connected to the PCB, the OSA further comprising a transducer housed in the receptacle.
8. The optoelectronic module as recited in claim 7 , wherein the optoelectronic module has a form factor that is substantially compliant with one or the following MSAs: SFF, SFP, XFP, XPAK, X2, or XENPAK.