Method for fixing printed circuit board on a display panel
View Patent ↗A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
1. A method for fixing a printed circuit board on a display panel, comprising:
coupling the display panel with a mold frame, the display panel having the printed circuit board electrically connected to the display panel;
positioning the printed circuit board on a rear surface of the display panel;
attaching a first double-sided tape on a first insulating film;
aligning the first insulating film to cover the outer surface of the printed circuit board; and
attaching the first insulating film to a first portion of the mold frame and the printed circuit board using the first double-sided tape, the first insulating film covering an outer surface of the printed circuit board and one side of the mold frame, wherein the first insulating film has a protruding portion protruding toward another side of the mold frame.
2. The method according to claim 1 , further comprising:
attaching a second double-sided tape on the second insulating film;
aligning the second insulating film to cover the protruding portion of the first insulating film; and
attaching the second insulating film to a second portion of the mold frame and the first insulating film using the second double-sided tape, the second insulating film covering a protruding portion and the other side of the mold frame so that the printed circuit board is fixed to the mold frame.
3. A method for fixing a printed circuit board on a display panel, comprising:
coupling a mold frame with the display panel, the display panel having a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel;
attaching a first insulating film to the mold frame and the printed circuit board using a first double-sided tape, the first insulating film covering an outer surface of the printed circuit board and one side of the mold frame, wherein the first insulating film has a protruding portion protruding toward another side of the mold frame; and
attaching a second insulating film to the mold frame and the first insulating film using a second double-sided tape, the second insulating film covering the protruding portion and the other side of the mold frame so that the printed circuit board is fixed to the mold frame.