Touch panel and method of manufacturing the same
An upper substrate that has upper conductive layer formed on a bottom surface thereof, is bonded to lower substrate, that has lower conductive layer opposed to the upper conductive layer with a predetermined space held therebetween, on a top surface of lower substrate by an adhesive layer that is made of a thermoplastic resin containing a tackifier dispersed therein, with a bonding property of the adhesive layer being enhanced by pressing. Addition of the tackifier increases flexibility of the adhesive layer and performs bonding with a large adhesive area at pressing. Thus, a width of the adhesive layer can be as small as approximately 1 to 1.5 mm. This can provide a smaller touch panel ensuring a predetermined touch sensitive area.
1. A touch panel comprising:
an upper substrate having an upper conductive layer on a bottom surface thereof;
a lower substrate having a lower conductive layer thereon, said lower conductive layer being opposed to said upper conductive layer with a predetermined space therebetween; and
an adhesive layer bonding said upper substrate and said lower substrate to one another, said adhesive layer including an adhesive material having a thermoplastic resin and a tackifier,
wherein said adhesive layer has an elastic modulus ranging from 10 3 Pa to 10 8 Pa, and
wherein said tackifier comprises a thermoplastic oligomer, and said adhesive material contains 1 gram to 35 grams of said tackifier in 100 grams of said thermoplastic resin.
2. The touch panel according to claim 1 , wherein
said thermoplastic resin contains at least one of acrylic resin and polyester resin.
3. The touch panel according to claim 2 , wherein
said adhesive material includes 1 gram to 20 grams of an isocyanate-containing curing agent dispersed in 100 grams of said thermoplastic resin.
4. The touch panel according to claim 1 , wherein
said adhesive layer is 1.0 mm to 1.5 mm wide.
5. The touch panel according to claim 1 , wherein
said adhesive layer is 5 μm to 50 μm thick.
6. The touch panel according to claim 1 , wherein
said thermoplastic resin comprises at least one of acrylic resin and polyester resin.
7. The touch panel according to claim 1 , wherein
said adhesive material contains 1 gram to 20 grams of an isocyanate-containing curing agent dispersed in 100 grams of said thermoplastic resin.
8. The touch panel according to claim 1 , wherein
said adhesive layer is 1.0 mm to 1.5 mm wide, and 5 μm to 50 μm thick; and
said thermoplastic resin contains at least one of acrylic resin and polyester resin.
9. A method of manufacturing a touch panel comprising:
printing an adhesive layer onto at least one of an upper substrate and a lower substrate, said upper substrate having an upper conductive layer on a bottom surface thereof and said lower substrate having a lower conductive layer thereon, and said adhesive layer including an adhesive material having a thermoplastic resin and a tackifier, with a bonding property of said adhesive material being enhanced by pressing;
opposing said upper substrate with said lower substrate such that said lower conductive layer is opposed to said upper conductive layer with a predetermined space therebetween; and
bonding said upper substrate and said lower substrate to one another by pressing said adhesive layer,
wherein said adhesive layer has an elastic modulus ranging from 10 3 Pa to 10 8 Pa, and
wherein said tackifier comprises a thermoplastic oligomer, and said adhesive material contains 1 gram to 35 grams of said tackifier in 100 grams of said thermoplastic resin.
10. The method of manufacturing a touch panel according to claim 9 , wherein
said thermoplastic resin contains at least one of acrylic resin and polyester resin.
11. The method of manufacturing a touch panel according to claim 10 , wherein
said adhesive material includes 1 gram to 20 grams of an isocyanate-containing curing agent dispersed in 100 grams of said thermoplastic resin.
12. The method according to claim 9 , wherein
said adhesive layer is 1.0 mm to 1.5 mm wide.
13. The method according to claim 9 , wherein
said adhesive layer is 5 μm to 50 μm thick.
14. The method according to claim 9 , wherein
said thermoplastic resin comprises at least one of acrylic resin and polyester resin.
15. The method according to claim 9 , wherein
said adhesive material contains 1 gram to 20 grams of an isocyanate-containing curing agent dispersed in 100 grams of said thermoplastic resin.
16. The method according to claim 9 , wherein
said adhesive layer is 1.0 mm to 1.5 mm wide, and 5 μm to 50 μm thick; and
said thermoplastic resin contains at least one of acrylic resin and polyester resin.