Motor driving inverter circuit module, motor driving apparatus having the motor driving inverter circuit module, and inverter integrated circuit package

1. A motor driving inverter integrated circuit package, comprising:

a lead frame comprising a plurality of chip pads;

a first-phase high voltage driver integrated circuit, a second-phase high voltage driver integrated circuit, and a third-phase high voltage driver integrated circuit, respectively mounted on corresponding chip pads of the plurality of the chip pads;

first-phase upper arm and lower arm transistor integrated circuits, second-phase upper arm and lower arm transistor integrated circuits, and third-phase upper arm and lower arm transistor integrated circuits, respectively mounted on corresponding chip pads of the plurality of the chip pads;

a plurality of first inner leads electrically connected to input terminals of the first-phase, second-phase, and third-phase high voltage driver circuits, respectively;

a plurality of second inner leads electrically connected to input terminals and output terminals of the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits, respectively;

a plurality of first outer leads connected to the first inner leads;

a plurality of second outer leads connected to the second inner leads;

a plurality of first wires electrically connecting the input terminals of the first-phase, second-phase, and third-phase high voltage driver integrated circuits to the first inner leads, respectively;

a plurality of second wires electrically connecting the output terminals of the first-phase, second-phase, and third-phase high voltage driver integrated circuits to gates of the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits, respectively;

a plurality of third wires electrically connecting the first-phase, second-phase, and third-phase upper arm transistor integrated circuits to the first-phase, second-phase, and third-phase lower arm transistor integrated circuits, respectively;

a plurality of fourth wires electrically connecting the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits to the second inner leads, respectively; and

a molding material molding the first and second inner leads, the first-phase, second-phase, and third-phase high voltage driver integrated circuits, the first-phase, second-phase, and third-phase upper and lower transistor integrated circuits, and the pluralities of first, second, third, and fourth wires;

wherein the motor driving inverter integrated circuit package is one of a surface mounted device (SMD) or a dual in line package (DIP);

wherein at least one group of the group of the first inner leads and the group of the second inner leads is disposed at a height different from that of the chip pads such that a thickness of the molding material for the integrated circuit package can be reduced.

2. The motor driving inverter integrated circuit package of claim 1 , wherein the first outer leads and the second outer leads have essentially the same size and shape.

3. The motor driving inverter integrated circuit package of claim 1 , wherein the first-phase, second-phase, and third-phase high voltage driver integrated circuits are arranged in essentially a straight line on the lead frame, and the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits are respectively arranged parallel to the first-phase, second-phase, and third-phase high voltage driver integrated circuits.

4. The motor driving inverter integrated circuit package of claim 1 , wherein

a first group of the second inner leads is connected to the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits by the fourth wires from the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits; and

a second group of the second inner leads is integrated into the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits, and

outer leads connected to the first group of the second inner leads act as sensing terminals for sensing a first-phase current, a second-phase current, and a third-phase current of a motor.

5. The motor driving inverter integrated circuit package of claim 4 , wherein among the outer leads connected to the first group of the second inner leads, outer leads acting as the sensing terminals for sensing the first-phase and second-phase currents are connected to each other to act as a common sensing terminal, or are separated from each other to act as separate sensing terminals.

6. A motor driving inverter integrated circuit package, comprising:

a lead frame comprising a plurality of chip pads;

a first-phase high voltage driver integrated circuit, a second-phase high voltage driver integrated circuit, and a third-phase high voltage driver integrated circuit, respectively mounted in a substantially straight line on corresponding chip pads of the plurality of the chip pads;

first-phase upper arm and lower arm transistor integrated circuits, second-phase upper arm and lower arm transistor integrated circuits, and third-phase upper arm and lower arm transistor integrated circuits, respectively arranged in the same direction as that of the first-phase, second-phase, and third-phase high voltage driver integrated circuits, on corresponding chip pads of the plurality of the chip pads;

a group of a plurality of first inner leads and a group of a plurality of second inner leads electrically connected to the first-phase, second-phase, and third-phase high voltage driver integrated circuits and the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits, respectively;

a group of a plurality of first outer leads connected to the first inner leads;

a group of a plurality of second outer leads connected to the second inner leads;

a plurality of wires

electrically connecting the first-phase, second-phase, and third-phase high voltage driver integrated circuits to the first inner leads;

electrically connecting the first-phase, second-phase, and third-phase high voltage driver integrated circuits to the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits;

electrically connecting the first-phase, second-phase, and third-phase upper arm transistor integrated circuits to the first-phase, the second-phase, and the third-phase lower arm transistor integrated circuits; and

electrically connecting the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits to the plurality of the second inner leads; and

a molding material molding the first and second inner leads, the first-phase, second-phase, and third-phase high voltage driver integrated circuits, the first-phase, second-phase, and third-phase upper and lower transistor integrated circuits, and the wires;

wherein the motor driving inverter integrated circuit package is one of a surface mounted device (SMD) or a dual in line package (DIP);

wherein at least one group of the group of the first inner leads and the group of the second inner leads is disposed at a height different from that of the chip pads such that a thickness of the molding material for the integrated circuit package can be reduced.

7. The motor driving inverter integrated circuit package of claim 6 , wherein the at least one inner lead, disposed at a height different from the height of the chip pads, is a first inner lead connected to the first-phase, second-phase, and third-phase high voltage driver integrated circuits.

8. The motor driving inverter integrated circuit package of claim 7 , wherein the at least one inner lead comprises a curved portion.

9. The motor driving inverter integrated circuit package of claim 6 , wherein first chip pads on which the first-phase, second-phase, and third-phase high voltage driver integrated circuits are mounted, among the chip pads of the lead frame, are molded to be disposed higher than second chip pads on which the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits are mounted.

10. The motor driving inverter integrated circuit package of claim 9 , wherein a portion of the molding material, which molds a back surface of the second chip pad opposite to a front surface where the first-phase, second-phase, and third-phase upper arm and lower arm transistor integrated circuits are mounted on the second chip pads, has a thickness between 0.1 and 0.5 mm.