Material processing system with variable repetition rate laser
View Patent ↗A system for using a pulsed laser beam to process materials includes a selector for varying the pulse repetition rate of the laser beam. Also included is a control unit for identifying an optimal pulse repetition rate that is compatible with the required pulse energy level for processing the material. Variations in the pulse repetition rate can be made during a procedure pursuant to either pre-programmed instructions, or in response to closed loop feedback controls.
1. A system for processing materials which comprises:
a laser source for generating a beam of laser pulses having a required first pulse repetition rate (R 1 ) with a first predetermined energy level in each laser pulse to process a first material at a first target area, and for alternately generating a required second pulse repetition rate (R 2 ) with a second predetermined energy level in each laser pulse to process a second material at a second target area, wherein the first material is contiguous with and different from the second material;
an optical means for directing the laser beam to the respective target areas in the material to alter the respective material therein with an interaction to induce a characteristically identifiable response from the respective material;
a detector for monitoring the identifiable response in the respective material; and
a switch for changing between the first required pulse repetition rate R 1 and the second required pulse repetition rate R 2 in response to changes in the identifiable response in the material.
2. A system as recited in claim 1 wherein an interaction is a laser induced optical breakdown (LIOB), wherein the material is a substantially transparent material, and wherein the first required pulse repetition rate (R 1 ) is maintained by the selector for use on a procedure section having a relatively high energy processing requirement (P 1 ), and the second required pulse repetition rate (R 2 ) is maintained by the selector for use on a procedure section having a relatively low energy processing requirement (P 2 ), and wherein R 1 is less than R 2 (R 1 <R 2 ).
3. A system as recited in claim 1 wherein the identifiable response is a gas bubble and the switch changes between R 1 and R 2 in response to a predetermined change in the diameter of the gas bubble.
4. A system as recited in claim 1 wherein an interaction is selected from a group consisting of laser induced optical breakdown (LIOB), photodecomposition, and photoablation.
5. A system as recited in claim 4 wherein the identifiable response from photoablation is a plasma spark.
6. A system as recited in claim 1 wherein establishment of the required pulse repetition rate is accomplished by a selector in accordance with a pre-programmed procedure.
7. A system as recited in claim 1 wherein establishment of the required pulse repetition rate is accomplished by a selector in response to closed loop feedback control.
8. A system as recited in claim 1 wherein an optical means directs the laser beam along a path through the material.
9. A system as recited in claim 1 wherein each laser pulse has a duration in a range including femtoseconds and picoseconds.
10. A system for processing materials with a required energy level which comprises:
a laser source for generating a beam of laser pulses having a pulse repetition rate variable between a required first pulse repetition rate (R 1 ) with a first predetermined energy level in each laser pulse to process a first material at a first target area, and for alternately generating a required second pulse repetition rate (R 2 ) with a second predetermined energy level in each laser pulse to process a second material at a second target area, wherein the first material is contiguous with and different from the second material;
an optical means for directing the laser beam to a target area in the respective material to alter the material therein with an interaction to induce a characteristically identifiable response from the respective material;
a means for identifying a required pulse repetition rate to achieve the required energy level at the target area;
a means for establishing the required pulse repetition rate to maintain the required energy level in the laser pulses for processing the material;
a monitoring means for detecting the identifiable response in the respective material; and
a means for changing between the first required pulse repetition rate R 1 and the second required pulse repetition rate R 2 in response to changes in the identifiable response in the material.
11. A system as recited in claim 10 wherein an identifying means is a control unit and an establishing means is a selector.
12. A system as recited in claim 10 wherein the material is a substantially transparent material, and wherein the first required pulse repetition rate (R 1 ) is maintained by a selector for use on a procedure section having a relatively high energy processing requirement (P 1 ), and the second required pulse repetition rate (R 2 ) is maintained by the selector for use on a procedure section having a relatively low energy processing requirement (P 2 ), and wherein R 1 is less than R 2 (R 1 <R 2 ).
13. A system as recited in claim 10 wherein the identifiable response is a gas bubble and a switch changes between R 1 and R 2 in response to a predetermined change in the diameter of the gas bubble.
14. A method for processing materials which comprises the steps of:
determining a required energy level for processing the material;
providing a laser source for generating a beam of laser pulses having a pulse repetition rate variable between a required first pulse repetition rate (R 1 ) with a first predetermined energy level in each laser pulse to process a first material at a first target area, and for alternately generating a required second pulse repetition rate (R 2 ) with a second predetermined energy level in each laser pulse to process a second material at a second target area, wherein the first material is contiguous with and different from the second material;
directing the laser beam to a target area in the respective material;
identifying a required pulse repetition rate to achieve the required energy level at the target area;
establishing the required pulse repetition rate to maintain the required energy level in the laser pulses for processing the material;
monitoring the identifiable response in the respective material resulting from the establishing step; and
changing between the first required pulse repetition rate R 1 and the second required pulse repetition rate R 2 in response to changes in the identifiable response in the material.
15. A method recited in claim 14 further comprising the steps of:
maintaining the first required pulse repetition rats (R 1 ) for use on a procedure section having a relatively high energy processing requirement (P 1 ); and
maintaining the second required pulse repetition rate (R 2 ) for use on a procedure section having a relatively low energy processing requirement (P 2 ), and wherein R 1 is less than R 2 (R 1 <R 2 ).