IP Library Granted Patent US 7,654,643
Granted Patent B2
US 7,654,643 · App. 12/116,904 · Granted Feb 2, 2010

Inkjet printhead nozzle assembly having a raised rim to support an ink meniscus

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Quick Facts
Patent No.
US 7,654,643
App. No.
12/116,904
Granted
Feb 2, 2010
Kind
B2
Abstract

Provided is a nozzle assembly for an inkjet printhead. The nozzle assembly includes a substrate defining a nozzle chamber and an ink inlet channel leading to the chamber. The nozzle assembly also includes a nozzle defined on the substrate and located over the nozzle chamber, the nozzle having a crown portion with a skirt portion depending from the crown portion, the skirt portion forming a first part of a peripheral wall portion of the nozzle chamber, the nozzle surrounded by a raised rim which supports a meniscus of a body of ink in the nozzle chamber. Also included is an actuator with a connecting arm fast with the nozzle to operatively displace the nozzle towards the substrate, wherein the nozzle, actuator and connecting arm are defined according to micro-electromechanical systems (MEMS) techniques.

Claims (10)

1. A nozzle assembly for an inkjet printhead, said nozzle assembly comprising:

a substrate defining a nozzle chamber and an ink inlet channel in fluid communication with said chamber;

a nozzle defined on the substrate and located over the nozzle chamber, said nozzle having a crown portion with a skirt portion depending from the crown portion, the skirt portion forming a first part of a peripheral wall portion of the nozzle chamber, the nozzle surrounded by a raised rim which supports a meniscus of a body of ink in the nozzle chamber; and

an actuator with a connecting arm fast with the nozzle to operatively displace the nozzle towards the substrate, wherein the nozzle, actuator and connecting arm are the result of micro-electromechanical systems (MEMS) fabrication techniques.

2. The nozzle assembly of claim 1 , wherein the substrate includes a silicon wafer on which a dielectric layer is deposited followed by a CMOS passivation layer.

3. The nozzle assembly of claim 1 , wherein a wall portion defines a second part of the peripheral wall of the nozzle chamber, the second part having an inwardly directed lip which utilizes a surface tension of the meniscus as a seal for inhibiting the escape of ink from the nozzle chamber when the nozzle is displaced by the connecting arm.

4. The nozzle assembly of claim 1 , wherein the actuator is a thermal bend actuator and is connected to an anchor extending upwardly from the CMOS passivation layer, the anchor mounted on conductive pads which form an electrical connection with the actuator.

5. The nozzle assembly of claim 4 , wherein the actuator includes a first, active beam arranged above a second, passive beam, both beams including a conductive ceramic material.

6. The nozzle assembly of claim 5 , wherein the conductive ceramic material includes titanium nitride (TiN) with both beams having their first ends anchored to the anchor and their opposed ends connected to the connecting arm.

7. The nozzle assembly of claim 5 , which is configured so that when a current is caused to flow through the active beam, thermal expansion of the beam results which is not present in the passive beam, so that a bending moment is created causing the arm to displace the nozzle towards the substrate.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028581/0688 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2008
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 020916/0278 →