Semiconductor device
Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element.
1. A semiconductor device in which a second semiconductor element is laminated and mounted by flip chip connection in a stacked state on a first semiconductor element which is wire bonded on a wiring substrate,
wherein the first semiconductor element and second semiconductor element generate heat at different times, and the heat generating areas of the first semiconductor element and second semiconductor element comprise a mounting structure included in a superposed arrangement seen from a vertical direction from a main circuit surface of the wiring substrate wherein the first semiconductor element is a lateral diffusion metal oxide film semiconductor (LDMOS) formed on a silicon substrate, and the second semiconductor element is a hetero junction bipolar transistor (HBT) formed on a substrate from one of gallium arsenide and silicon germanium, and wherein the first semiconductor element and second semiconductor element are power amplifiers used in current amplification in a high frequency radio communication circuit, and the second semiconductor element mainly constitutes a current amplifier circuit, and the first semiconductor element mainly constitutes a circuit to control current amplification of the second semiconductor element.
2. The semiconductor device according to claim 1 ,
wherein the first semiconductor element is wider in area in the direction parallel to a main circuit surface of the wiring substrate than the second semiconductor element.
3. The semiconductor device according to claim 1 ,
wherein the first semiconductor element and second semiconductor element are power amplifiers used in current amplification in a high frequency radio communication circuit, and the first semiconductor element and the second semiconductor element are power amplifiers corresponding to different frequency bands and communication standards of at least one or more types.
4. A semiconductor device in which a second semiconductor element is laminated and mounted by flip chip connection in a stacked state on a first semiconductor element which is wire bonded on a wiring substrate,
wherein the first semiconductor element and second semiconductor element generate heat at different times, and when the second semiconductor element performs a heat generating operation, the first semiconductor element having a heat diffusion plate diffuses a heat generating loss arisen from the second semiconductor element in the direction parallel with a main circuit surface of the wiring substrate wherein the first semiconductor element is a lateral diffusion metal oxide film semiconductor (LDMOS) formed on a silicon substrate, and the second semiconductor element is a hetero junction bipolar transistor (HBT) formed on a substrate from one of gallium arsenide and silicon germanium, and wherein the first semiconductor element and second semiconductor element are power amplifiers used in current amplification in a high frequency radio communication circuit, and the second semiconductor element mainly constitutes a current amplifier circuit, and the first semiconductor element mainly constitutes a circuit to control current amplification of the second semiconductor element.
5. The semiconductor device according to claim 4 ,
wherein the first semiconductor element is wider in area in the direction parallel to a main circuit surface of the wiring substrate than the second semiconductor element.
6. The semiconductor device according to claim 4 ,
wherein the first semiconductor element and second semiconductor element are power amplifiers used in current amplification in a high frequency radio communication circuit, and the first semiconductor element and the second semiconductor element are power amplifiers corresponding to different frequency bands and communication standards of at least one or more types.