Objective holder for camera module
An exemplary objective holder engages with a PCB substrate having an image sensor and several passive components arranged thereon. The passive components surround the image sensor. The objective includes a lens barrel extending from a side of a base, and a plurality of walls extending from an opposite side of the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components therein. A transparent cover is received in the objective holder between the lens barrel and the chamber. An adhesive is used to connect the objective holder to the PCB substrate. The PCB substrate is rested on the walls. At least one of the notches communicates the chamber to an exterior for outgassing and is sealed by a mass of sealing material after a heating process of the adhesive.
1. An objective holder for engaging with a PCB substrate, the PCB substrate having an image sensor and a plurality of passive components arranged thereon, the objective holder comprising:
a base,
a lens barrel extending from a side of the base; and
a plurality of walls extending from an opposite side of the base, the walls enclosing a chamber thereamong for receiving the image sensor and defining notches therein for receiving the passive components, at least one of the notches communicating the chamber to an exterior for outgassing.
2. The objective holder as claimed in claim 1 , wherein a flange extends inwardly from the base, between the barrel and the chamber.
3. The objective holder as claimed in claim 2 , wherein a room is defined in the base adjacent to the chamber, and wherein a transparent cover is received in the room and abuts against the flange.
4. The objective holder as claimed in claim 3 , wherein the room is smaller than the chamber.
5. The objective holder as claimed in claim 3 , wherein a plurality of holes are defined in the base communicating with the room to allow sealing material to be placed in the room.
6. The objective holder as claimed in claim 5 , wherein the holes communicate with corners of the room.
7. A combination comprising:
a PCB substrate with an image sensor and a plurality of passive components thereon, the passive components surrounding the image sensor;
an objective holder comprising a lens barrel and a plurality of walls opposite to the lens barrel, the walls enclosing a chamber thereamong and defining notches therein, the chamber receiving the image sensor, the notches receiving the passive components therein, the PCB substrate contacting the walls and at least one of the notches communicating the chamber to an exterior for outgassing;
a transparent cover received in the objective holder between the lens barrel and the chamber;
an adhesive connecting the objective holder to the PCB substrate; and
at least one mass of sealing material sealing the at least one of the notches after a heating process of the adhesive.
8. The combination as claimed in claim 7 , wherein a flange extends inwardly from the objective holder, between the barrel and the chamber.
9. The combination as claimed in claim 8 , wherein a room is defined in the objective holder adjacent to the chamber, and wherein the transparent cover is received in the room and abuts against the flange.
10. The combination as claimed in claim 9 , wherein the room is smaller than the chamber.
11. The combination as claimed in claim 9 , wherein a plurality of holes are defined in the base communicating with the room to allow sealing material to be placed in the room.
12. The combination as claimed in claim 11 , wherein the holes communicate with corners of the room.
13. The combination as claimed in claim 7 , wherein depths of the notches are larger than heights of the passive components.