Method and device for sensing wear
A sensor for detecting erosion of a wear surface of a component, particularly a liner attached to the mill shell of a rotating grinding mill. The sensor comprises a conductive element embedded in the component, the conductive element comprising a first end positioned at a first distance from the wear surface, at least one conductive loop comprising a wear portion positioned at a second distance from the wear surface proximate to the first end and a circuit coupled to the at least one element for determining a continuity of the conductive loop.
1. A sensor for detecting erosion of a wear surface of a component, the sensor comprising:
at least one conductive trace on a substrate, said substrate attached to the component such that a wearing portion of said trace between a first trace end and a second trace end comes within a predetermined distance from the wear surface; and
a circuit for sensing when said first end is isolated from said second end;
wherein the component is manufactured from a material selected from the group consisting of rubber, cast iron, steel and ceramics or combinations thereof.
2. The sensor of claim 1 , wherein said substrate is embedded in the component.
3. The sensor of claim 1 , wherein the component comprises a second non-wear surface intersecting the wear surface, and wherein said substrate is fastened to the non-wear surface.
4. The sensor of claim 3 , further comprising an adhesive for fastening said substrate to the non-wear surface.
5. The sensor of claim 2 , wherein said substrate is laminated into the component.
6. The sensor of claim 2 , wherein the component comprises a cavity machined therein and further comprising a filler material for retaining said substrate in the cavity.
7. The sensor of claim 6 , wherein said filler material is an epoxy.
8. The sensor of claim 1 , wherein said substrate is a PCB.
9. The sensor of claim 8 , wherein said PCB is flexible.
10. The sensor of claim 9 , wherein said flexible PCB is rolled up.
11. The sensor of claim 10 , wherein said rolled up flexible PCB is retained in a cavity machined in the component.
12. The sensor of claim 9 , further comprising a rod for supporting said flexible PCB, and wherein said flexible PCB is wound around said rod.
13. The sensor of claim 12 , further comprising an adhesive bonding said flexible PCB to said rod.
14. The sensor of claim 13 , wherein said rolled up flexible PCB is retained in the cavity using a filler material.