IP Library Granted Patent US 7,686,621
Granted Patent B2
US 7,686,621 · App. 12/046,804 · Granted Mar 30, 2010

Integrated circuit test socket having elastic contact support and methods for use therewith

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Quick Facts
Patent No.
US 7,686,621
App. No.
12/046,804
Granted
Mar 30, 2010
Kind
B2
Abstract

A socket can be used for testing an integrated circuit package having a plurality of rows of leads. The socket includes a base that is aligned with a circuit board having a plurality of contact pads. A plurality of rows of contact fingers are electrically coupled to the plurality of contact pads, each of the plurality of rows of contact fingers for engaging a corresponding one of the plurality of rows of leads in response to a retention force applied to the integrated circuit package. Each of the contact finger has a cantilevered end that is supported by a supporting force generated by an elastic contact in response to the retention force.

Claims (34)

1. A device for interfacing with an integrated circuit package having a plurality of rows of leads, the device comprising:

a base that is aligned with a circuit board having a plurality of contact pads;

a plurality of rows of contact fingers, electrically coupled to the plurality of contact pads, each of the plurality of rows of contact fingers for engaging a corresponding one of the plurality of rows of leads in response to a retention force applied to the integrated circuit package, each of the contact fingers having a first end that is cantilevered, a second end, and being substantially straight between the first end and the second end; and

an elastic contact support that is coupled to provide a first supporting force on the first end of each of the contact fingers in response to the retention force.

2. The device of claim 1 wherein the elastic contact support includes at least one elastic strip that supports the first ends of at least one of the plurality of rows of contact fingers.

3. The device of claim 1 wherein the elastic contact support includes a contiguous elastic sheet that supports the first ends of the plurality of rows of contact fingers.

4. The device of claim 1 wherein the elastic contact support includes at least one of: a silicon rubber elastic member; a rubber elastic member; a plastic elastic member and a synthetic rubber elastic member.

5. The device of claim 1 wherein the elastic contact support includes an electrostatic discharge resistant material.

6. The device of claim 1 wherein the elastic contact support includes an insulating material.

7. The device of claim 1 wherein the integrated circuit package is a square surface mount package having four rows of leads.

8. The device of claim 1 further comprising:

a plurality of elastomeric strips that electrically couple the plurality of rows of contact fingers to the plurality of contact pads.

9. The device of claim 8 wherein the plurality of elastomeric strips each include a plurality of metal impregnated channels that electrically couple the plurality of rows of contact fingers to the plurality of contact pads.

10. The device of claim 1 wherein the socket is configured for cyclic testing of a plurality of integrated circuit packages including the integrated circuit package.

11. A method of coupling a first integrated circuit package, having a first plurality of rows of leads, to a circuit board having a plurality of contact pads, the method comprising:

providing a plurality of rows of contact fingers that are electrically coupled to a plurality of contact pads of a circuit board, wherein each of the contact fingers has a first end that is cantilevered, a second end, and being substantially straight between the first end and the second end;

applying a first retention force on the first integrated circuit package to engage each of the plurality of rows of contact fingers to a corresponding one of the first plurality of rows of leads; and

providing a first supporting force on the first end of each of the contact fingers in response to the first retention force via an elastic contact support.

12. The method of claim 11 wherein the elastic contact support includes at least one elastic strip that supports the first ends of at least one of the plurality of rows of contact fingers.

13. The method of claim 11 wherein the elastic contact support includes a contiguous elastic sheet that supports the first ends of the plurality of rows of contact fingers.

14. The method of claim 11 wherein the elastic contact support includes at least one of: a silicon rubber elastic member; a rubber elastic member; a plastic elastic member and a synthetic rubber elastic member.

15. The method of claim 11 wherein the elastic contact support includes an electrostatic discharge resistant material.

16. The method of claim 11 wherein the elastic contact support includes an insulating material.

17. The method of claim 11 wherein the first integrated circuit package is a square surface mount package having four rows of leads.

18. The method of claim 11 further comprising:

relieving the first retention force and removing the first integrated circuit package;

applying a second retention force on a second integrated circuit package, having a second plurality of rows of leads, to engage each of the plurality of rows of contact fingers to a corresponding one of the second plurality of rows of leads; and

providing a second supporting force on the first end of each of the contact fingers in response to the second retention force via the elastic contact support.

19. A device for interfacing with an integrated circuit package having a plurality of rows of leads, the device comprising:

a base that is aligned with a circuit board having a plurality of contact pads;

a row of contact fingers, the row of contact fingers for engaging a row of leads in response to a retention force applied to the integrated circuit package, each of the contact fingers having a cantilevered end;

an elastomeric strip that electrically couples the row of contact fingers to the plurality of contact pads; and

an elastic contact support that is coupled to provide a first supporting force on the cantilevered end of each of the contact fingers in response to the retention force.

20. The device of claim 19 wherein the elastomeric strip includes a plurality of metal impregnated channels that electrically couple the contact fingers to the plurality of contact pads.

Assignments (22)
CHANGE OF NAME Recorded Aug 31, 2017
From: SIGMATEL, INC.
To: SIGMATEL, LLC
Reel/Frame 043735/0306 →
MERGER Recorded Jul 26, 2017
From: SIGMATEL, LLC
To: NXP USA, INC.
Reel/Frame 043328/0351 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 037354 FRAME: 0773. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT RELEASE. Recorded Aug 15, 2016
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: SIGMATEL, LLC
Reel/Frame 039723/0777 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: SIGMATEL, INC.
Reel/Frame 037355/0838 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0027 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0866 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0120 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: SIGMATEL, INC.
Reel/Frame 037354/0734 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: SIGMATEL, INC.
Reel/Frame 037354/0773 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0194 →
SECURITY AGREEMENT Recorded Nov 12, 2013
From: SIGMATEL, LLC
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031626/0218 →
SECURITY AGREEMENT Recorded Jun 17, 2013
From: SIGMATEL, LLC
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030628/0636 →
SECURITY AGREEMENT Recorded Sep 3, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024933/0340 →
SECURITY AGREEMENT Recorded Sep 3, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 024933/0316 →
SECURITY AGREEMENT Recorded Sep 1, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024915/0759 →
SECURITY AGREEMENT Recorded Sep 1, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 024915/0777 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded May 10, 2010
From: SIGMATEL, LLC
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 024358/0439 →
SECURITY AGREEMENT Recorded Mar 16, 2010
From: SIGMATEL, LLC
To: CITIBANK, N.A.
Reel/Frame 024079/0406 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →