IP Library Granted Patent US 7,687,735
Granted Patent B2
US 7,687,735 · App. 12/130,554 · Granted Mar 30, 2010

Packaging structure for depression switches

Assignee: Sipix Technology Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,687,735
App. No.
12/130,554
Granted
Mar 30, 2010
Kind
B2
Abstract

A packaging structure for depression switches includes an electronic substrate containing at least one switch electrode, a push-on switch located on the electronic substrate to connect the switch electrode to generate a command signal and a sealing member. The push-on switch and the electronic substrate form a first air chamber between them. The sealing member has a fastening portion to seal the push-on switch on the electronic substrate and a second air chamber formed with the electronic substrate to communicate with the first air chamber. By depressing the push-on switch to connect the switch electrode, air held in the first air chamber is squeezed and flows to the second air chamber without escaping.

Claims (13)

1. A packaging structure for depression switches, comprising:

an electronic substrate which has at least one switch electrode;

a push-on switch located on the electronic substrate to connect the switch electrode to generate a command signal and form a first air chamber with the electronic substrate; and

a sealing member which has a fastening portion to seal the push-on switch on the electronic substrate and a second air chamber formed with the electronic substrate to communicate only with the first air chamber;

wherein connection of the switch electrode through the push-on switch causes the first air chamber to be squeezed and air in the first air chamber to flow into the second air chamber.

2. The packaging structure of claim 1 , wherein the second air chamber is located in the fastening portion.

3. The packaging structure of claim 1 , wherein the second air chamber is formed in a size proximate to the first air chamber.

4. The packaging structure of claim 1 , wherein the fastening portion and the electronic substrate form a bounding surface which has an adhesive layer located thereon.

5. The packaging structure of claim 1 , wherein the fastening portion is bonded to the electronic substrate and push-on switch at a bonding surface with an adhesive layer formed thereon.

6. The packaging structure of claim 1 , wherein the fastening portion has a depressing zone encasing the push-on switch.

7. An electronic device comprises the packaging structure of claim 1 .

8. The electronic device of claim 7 , wherein the electronic device is selectively an IC card or a RFID tag.

9. The packaging structure of claim 1 , wherein the second air chamber is not formed over a switch.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Jun 16, 2020
From: SIPIX TECHNOLOGY INC.; YUANHAN MATERIALS INC.
To: YUANHAN MATERIALS INC.
Reel/Frame 052944/0912 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2008
From: CHIEN, MING-CHIH; CHEN, JUNG-HSIU
To: SIPIX TECHNOLOGY INC.
Reel/Frame 021023/0500 →
Continuity (1)
Related Publication 20090294264A1 · Dec 3, 2009