IP Library Granted Patent US 7,706,421
Granted Patent B2
US 7,706,421 · App. 11/110,580 · Granted Apr 27, 2010

Temperature sensing device patterned on an electro-optic transducer die

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Quick Facts
Patent No.
US 7,706,421
App. No.
11/110,580
Granted
Apr 27, 2010
Kind
B2
Abstract

An optical transmit assembly having a temperature sensor patterned on an electro-optic transducer die. Due to the close proximity of the electro-optic transducer junction and the temperature sensor, the temperature sensor more accurately measures the temperature of the electro-optic transducer junction. This permits for more refined control of the frequency characteristics of optical light emitted by the electro-optic transducer junction since the emitted optical frequencies of most electro-optic transducers are heavily temperature dependent.

Claims (56)

1. An optical transmit assembly comprising:

an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including:

an optically emissive PN junction

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

a temperature sensor patterned directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction;

one or more electrical connections patterned on a surface of the electro-optical transducer die for establishing an electrical connection to determine a temperatures sensed by the temperature sensor; and

a substrate, wherein the electro-optic transducer is mounted on the substrate, wherein the surface of the electro-optic transducer to which the temperature sensor is patterned is most distant from the substrate.

2. An optical transmit assembly in accordance with claim 1 , wherein the electro-optic transducer is a laser.

3. An optical transmit assembly in accordance with claim 2 , wherein the laser is a Vertical Cavity Surface Emitting Laser (VCSEL).

4. An optical transmit assembly in accordance with claim 2 , wherein the laser is an edge emitting laser.

5. An optical transmit assembly in accordance with claim 1 , wherein the electro-optic transducer is a Light Emitting Diode (LED).

6. An optical transmit assembly in accordance with claim 1 , wherein the temperature sensor is a thin film thermocouple.

7. An optical transmit assembly in accordance with claim 1 , wherein the temperature sensor is a Resistance Temperature Detector (RTD).

8. An optical transmit assembly in accordance with claim 1 , wherein the temperature sensor is a thermistor.

9. An optical transmit assembly comprising:

an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including:

an optically emissive PN junction

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

a temperature sensor patterned directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction;

one or more electrical connections patterned on a surface of the electro-optical transducer die for establishing an electrical connection to determine a temperatures sensed by the temperature sensor; and

a substrate, wherein the electro-optic transducer is mounted on the substrate, wherein the surface of the electro-optic transducer to which the temperature sensor is patterned is most proximate to the substrate.

10. A method for manufacturing an optical transmit assembly comprising:

an act of positioning an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including:

an optically emissive PN junction;

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

an act of patterning a temperature sensor directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction; and

one or more electrical connections patterned on a surface of the electro-optic transducer die for establishing an electrical connection to determine a temperature sensed by the temperature sensor; and

an act of mounting the electro-optic transducer on a substrate such that the surface to which the temperature sensor is patterned is most proximate to the substrate.

11. A method for manufacturing an optical transmit assembly in accordance with claim 10 , wherein the electro-optic transducer is at least one of a laser and a Light Emitting Diode (LED).

12. A method for manufacturing an optical transmit assembly in accordance with claim 10 , wherein the temperature sensor is a thin film thermocouple.

13. A method for manufacturing an optical transmit assembly in accordance with claim 10 , wherein the temperature sensor is a Resistance Temperature Detector (RTD).

14. A method for manufacturing an optical transmit assembly in accordance with claim 10 , wherein the temperature sensor is a thermistor.

15. A method for manufacturing an optical transmit assembly comprising:

an act of positioning an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including:

an optically emissive PN junction;

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

an act of patterning a temperature sensor directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction; and

one or more electrical connections patterned on a surface of the electro-optic transducer die for establishing an electrical connection to determine a temperature sensed by the temperature sensor;

an act of mounting the electro-optic transducer on a substrate such that the surface to which the temperature sensor is patterned is most proximate the substrate;

an act of mounting the electro-optic transducer on the substrate such that the surface of the electro-optic transducer to which the temperature sensor is patterned on is most distant from the substrate.

16. An optical transmit assembly comprising:

laser die that emits light when current is passed through the laser die, wherein the laser die is a vertical cavity surface emitting laser die or an edge emitting laser die, the laser die including:

an optically emissive PN junction;

a top surface;

at least one electrical contact patterned on a surface of the vertical cavity surface emitting laser or edge emitting laser for applying a control current through the PN junction to control optical emissions form the PN junction;

a bottom surface; and

a temperature sensor selected from the set consisting of a thermister, a thin film thermocouple, and a resistance temperature detector patterned directly on a surface of the laser die

a substrate, wherein the temperature transducer is mounted on the substrate, wherein the surface of the electro-optic transducer to which the temperature sensor is patterned is most distant from, or most proximate to, the substrate.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →