Method of manufacturing a circuit board assembly for a controller
View Patent ↗A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of power tabs in the second printed circuit board. The power tabs are then slid into the slots and the tabs are flooded with copper. At this time the power tabs are soldered within the slots to provide an electrical connection between the first and second printed circuit boards that allows for the transfer of current between the boards of more than three amps.
1. A method of manufacturing a circuit board assembly for a controller, steps comprising:
providing a first printed circuit board having a plurality of copper pads with a slot disposed through at least one of the plurality of copper pads;
providing a second printed circuit board having a plurality of power tabs that correspond to the plurality of copper pads;
sliding at least one power tab through the slot to provide an electrical connection between the first and second printed circuit board wherein current passes from the first printed circuit board to the second printed circuit board; and
flooding the plurality of power tabs with copper to an edge of the second printed circuit board to maximize the current carrying capability between the first printed circuit board and the second printed circuit board.
2. The method of claim 1 wherein the slot is plated.
3. The method of claim 1 wherein the power tabs do not have a solder mask.
4. The method of claim 1 wherein the only connection between the first printed circuit board and the second printed circuit board are power tabs being disposed through slots.
5. The method of claim 1 wherein the plurality of copper pads each have a base wherein cut radii are located adjacent each base for enhanced soldering.
6. The method of claim 1 wherein the plurality of power tabs each have a base wherein cut radii are located adjacent the base for enhanced soldering.
7. The method of claim 1 further comprising the step of placing soldering paste on a first side of the slot.
8. The method of claim 7 further comprising the step of pushing the soldering paste through the first side of the slot to a second side of the slot with a power tab as the power tab is disposed through the slot.
9. The method of claim 8 further comprising the step of soldering the power tab at both the first and second sides of the slot to a copper pad.
10. The method of claim 1 wherein the sliding of at least one power tab through the slot secures the first printed circuit board perpendicular to the second printed circuit board.
11. The method of claim 1 wherein the copper pads extend outwardly from an edge of the first printed circuit board.
12. The method of claim 1 wherein the power tabs extend outwardly from an edge of the second printed circuit board.
13. The method of claim 1 wherein an edge of the first printed circuit board is positioned in an intermeshing relation with an edge of the second printed circuit board.