Circuit module with thermal casing systems
View Patent ↗Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
1. A circuit module, comprising:
a rigid substrate having two opposing lateral sides, an extension and an edge and a thermal sink accessible on at least one of the two opposing lateral sides of the substrate;
a flex circuit having first and second sides, the first side of the flex circuit having plural contacts adapted for connection to a circuit board socket and at least the first of the first and second sides of the flex circuit being populated with plural memory CSPs with the second major side of the flex circuit being populated with at least an AMB, the flex circuit being disposed about the edge of the rigid substrate to dispose the AMB in thermal contact with the thermal sink; and
at least one thermal spreader which is thermally connected to and adjacent to at least some of the plural memory CSPs and connected to the extension of the rigid substrate.
2. The circuit module of claim 1 in which the rigid substrate is comprised of thermally conductive material.
3. The circuit module of claim 1 in which at least a portion of the thermal sink provides an indentation into which, at least in part, a portion of the AMB is introduced.
4. The circuit module of claim 1 in which the thermal contact is realized through thermally conductive adhesive.
5. The circuit module of claim 1 in which both the first and second sides of the flex circuit are populated with plural memory CSPs.
6. The circuit module of claim 1 in which the rigid substrate and the at least one thermal spreader cooperate to provide a thermal conduction path between the substrate and the at least some of the plural ICs.