Carrier structure embedded with semiconductor chip
A carrier structure embedded with semiconductor chips is disclosed, which comprises a core board and a plurality of semiconductor chips mounted therein. The core board comprises two metal plates between which an adhesive material is disposed. An etching stop layer is deposited on the both surfaces of the core board. Pluralities of cavities are formed to penetrate through the core board. The semiconductor chips each have an active surface on which a plurality of electrode pads are disposed, and those are embedded in the cavities and mounted in the core board. An etching groove formed on the core board between the neighboring semiconductor chips is filled with the adhesive material. The present invention avoids the production of metal burrs when the carrier structure is cut.
1. A carrier structure embedded with semiconductor chips comprising:
a core board comprising two metal plates between which an adhesive material is disposed, wherein an etching stop layer is disposed on the both surfaces of the core board and a plurality of cavities are formed to penetrate through the etching stop layer and the core board;
a plurality of semiconductor chips embedded and mounted in the cavities, and each having an active surface on which a plurality of electrode pads are disposed; and
at least two etching grooves formed in the corresponding positions of the metal plates between the neighboring semiconductor chips, wherein the etching grooves are filled with the adhesive material.
2. The carrier structure as claimed in claim 1 , wherein the semiconductor chips are mounted in the cavities by the adhesive material.
3. The carrier structure as claimed in claim 1 , wherein the surface of the etching stop layer, which is unconnected to the etching grooves, has a Cu layer thereon.
4. The carrier structure as claimed in claim 1 , wherein the metal plates are made of Al, Cu, Fe, or the alloy thereof.
5. The carrier structure as claimed in claim 1 , wherein the material of the etching stop layer disposed on the both surfaces of the core board is the same or different.
6. The carrier structure as claimed in claim 1 , wherein the adhesive material is an insulating material or a prepreg material.
7. The carrier structure as claimed in claim 1 , further comprising a build up circuit layer structure formed on the surface of the carrier structure and on the active surfaces of the semiconductor chips, wherein the build up circuit layer structure has a plurality of conductive structures therein so as to conduct the semiconductor chips, and has conductive pads formed on the surface thereof.
8. The carrier structure as claimed in claim 7 , wherein the build up circuit layer structure comprises a dielectric layer, a circuit layer stacked on the dielectric layer, and the conductive structures formed in the dielectric layer and connecting to the circuit layer.
9. The carrier structure as claimed in claim 7 , further comprising a solder mask formed on the surface of the build up circuit layer structure, wherein the solder mask has a plurality of openings formed on the surface thereof so as to reveal the conductive pads of the build up circuit layer structure.
10. A separated carrier structure embedded with a single semiconductor chip, which is formed by separating a carrier structure, wherein the carrier structure comprises:
a core board comprising two metal plates between which an adhesive material is disposed, wherein an etching stop layer is disposed on the both surfaces of the core board and a plurality of cavities are formed to penetrate through the etching stop layer and the core board;
a plurality of semiconductor chips embedded and mounted in the cavities, and each having an active surface on which a plurality of electrode pads are disposed;
at least two etching grooves formed in the corresponding positions of the metal plates between the neighboring semiconductor chips, wherein the etching grooves are filled with the adhesive material;
a build up circuit layer structure formed on the surface of the carrier structure and on the active surfaces of the semiconductor chips, wherein the build up circuit layer structure has a plurality of conductive structures therein so as to conduct the semiconductor chips, and has conductive pads formed on the surface thereof; and
a solder mask formed on the surface of the build up circuit layer structure, wherein the solder mask has a plurality of openings formed on the surface thereof so as to reveal the conductive pads of the build up circuit layer structure,
wherein the carrier structure is separated by the etching grooves so as to form the separated carrier structure which is surrounded by the adhesive material.
11. The separated carrier structure as claimed in claim 10 , further comprising conductive elements formed in the openings of the solder mask and conducting the conductive pads.
12. The separated carrier structure as claimed in claim 11 , wherein the conductive elements are solder balls, acicular metals, or conductive adhesive materials.