IP Library Granted Patent US 7,791,434
Granted Patent B2
US 7,791,434 · App. 11/021,085 · Granted Sep 7, 2010

Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric

Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 7,791,434
App. No.
11/021,085
Granted
Sep 7, 2010
Kind
B2
Abstract

An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, and a second electrode. The substrate has a first surface and the first electrode is adjacent the first surface of the substrate. The layer of piezoelectric material is adjacent the first electrode. The second electrode is adjacent the layer of piezoelectric material, and the second electrode lies in a first plane and has an edge. The layer of piezoelectric material has a recessed feature adjacent the edge of the second electrode.

Claims (65)

1. An acoustic resonator comprising:

a substrate;

a first electrode adjacent the substrate;

a piezoelectric layer adjacent the first electrode;

a trench provided in the piezoelectric layer, wherein the trench is configured to reduce energy loss in the acoustic resonator;

a second electrode adjacent the piezoelectric layer, the second electrode lying in a first plane and having an edge; and

an acoustic mirror is disposed in the substrate, wherein the first electrode spans the acoustic mirror.

2. The acoustic resonator of claim 1 further including a passivation layer adjacent the second electrode, the passivation layer lying in a second plane that is generally parallel to the first plane and having an edge.

3. The acoustic resonator of claim 1 , wherein the trench in the piezoelectric layer is outside the edge of the second electrode.

4. The acoustic resonator of claim 3 , wherein the trench extends around a substantial portion of the perimeter of the second electrode.

5. The acoustic resonator of claim 3 wherein the trench is offset from the edge of second electrode by zero to 10s of microns.

6. The acoustic resonator of claim 1 further including fill material in the trench of the piezoelectric layer.

7. The acoustic resonator of claim 6 , wherein the second electrode comprises a material that is the same as the fill material in the trench.

8. The acoustic resonator of claim 6 , wherein the fill material is a material selected from the group comprising dielectrics, metals, piezoelectrics, Mo, Pt, Al, Cu, W, Au, Ag, polyimide, benzocyclobutene, SiO 2 , Si 3 N 4 , AlN, ZnO, LiNbO 3 , PZT, LiTaO 3 , and Al 2 O 3 .

9. The acoustic resonator of claim 1 wherein the trench has a depth in the piezoelectric layer that is on the order of hundreds to thousands of angstroms and a width on the order of fractions of a micron to microns.

10. An acoustic resonator comprising:

a substrate having a first surface; a first electrode adjacent the first surface of the substrate;

a layer of piezoelectric material adjacent the first electrode;

a trench provided in the layer of piezoelectric material;

a second electrode adjacent the layer of piezoelectric material, the second electrode lying in a first plane and having an edge; and

a passivation layer adjacent the second electrode, the passivation layer lying in a second plane that is generally parallel to the first plane and having an edge; wherein the trench is configured to reduce energy loss in the acoustic resonator.

11. The acoustic resonator of claim 10 wherein a depression is formed in the first surface of the substrate and wherein the first electrode spans the depression.

12. The acoustic resonator of claim 10 wherein an acoustic mirror is formed in the first surface of the substrate and wherein the first electrode spans the acoustic mirror.

13. The acoustic resonator of claim 10 further including fill material in the trench of the layer of piezoelectric material.

14. The acoustic resonator of claim 13 , wherein the second electrode comprises a material that is the same as the fill material in the trench.

15. The acoustic resonator of claim 13 wherein the fill material is a material selected from the group comprising dielectrics, metals, piezoelectrics, Mo, Pt, Al, Cu, W, Au, Ag, polyimide, benzocyclobutene, SiO 2 , Si 3 N 4 , AlN, ZnO, LiNbO 3 , PZT, LiTaO 3 , and Al 2 O 3 .

16. The acoustic resonator of claim 10 , wherein the trench in the piezoelectric layer is outside the edge of the second electrode.

17. An acoustic resonator comprising:

a substrate;

a first electrode adjacent the substrate;

a piezoelectric layer adjacent the first electrode;

a trench provided in the piezoelectric layer; and

a second electrode adjacent the piezoelectric layer, the second electrode lying in a first plane and having an edge, wherein the trench has a depth in the piezoelectric layer that is on the order of hundreds to thousands of angstroms and a width on the order of fractions of a micron to microns.

18. An acoustic resonator as claimed in claim 17 , wherein the trench in the piezoelectric layer is outside the edge of the second electrode.

19. An acoustic resonator comprising:

a substrate;

a first electrode adjacent the substrate;

a piezoelectric layer adjacent the first electrode;

a trench provided in the piezoelectric layer;

fill material in the trench of the piezoelectric layer; and

a second electrode adjacent the piezoelectric layer, the second electrode lying in a first plane and having an edge.

20. An acoustic resonator as claimed in claim 19 , wherein the second electrode comprises a material that is the same as the fill material in the trench.

21. An acoustic resonator as claimed in claim 19 , wherein the fill material is a material selected from the group comprising dielectrics, metals, piezoelectrics, Mo, Pt, Al, Cu, W, Au, Ag, polyimide, benzocyclobutene, SiO 2 , Si 3 N 4 , AlN, ZnO, LiNbO 3 , PZT, LiTaO 3 , and Al 2 O 3 .

22. An acoustic resonator comprising:

a substrate having a first surface; a first electrode adjacent the first surface of the substrate;

a layer of piezoelectric material adjacent the first electrode; a second electrode adjacent the layer of piezoelectric material, the second electrode lying in a first plane and having an edge; and

a passivation layer adjacent the second electrode, the passivation layer lying in a second plane that is generally parallel to the first plane and having an edge; wherein the layer of piezoelectric material comprises a trench adjacent the edge of the second electrode; and

fill material in the trench of the layer of piezoelectric material.

23. An acoustic resonator as claimed in claim 22 , wherein the second electrode comprises a material that is the same as the fill material in the trench.

24. An acoustic resonator as claimed in claim 22 , wherein the fill material is a material selected from the group comprising dielectrics, metals, piezoelectrics, Mo, Pt, Al, Cu, W, Au, Ag, polyimide, benzocyclobutene, SiO 2 , Si 3 N 4 , AlN, ZnO, LiNbO 3 , PZT, LiTaO 3 , and Al 2 O 3 .

25. An acoustic resonator comprising:

a substrate;

a first electrode adjacent the substrate;

a piezoelectric layer adjacent the first electrode;

a trench provided in the piezoelectric layer, wherein the trench is configured to reduce energy loss in the acoustic resonator;

a second electrode adjacent the piezoelectric layer, the second electrode lying in a first plane and having an edge; and

a depression disposed in the substrate, wherein the first electrode spans the depression.

26. The acoustic resonator of claim 25 further comprising a passivation layer adjacent the second electrode, the passivation layer lying in a second plane that is generally parallel to the first plane and having an edge.

27. The acoustic resonator of claim 25 , wherein the trench in the piezoelectric layer is disposed outside the edge of the second electrode.

28. The acoustic resonator of claim 27 , wherein the trench extends around a substantial portion of the perimeter of the second electrode.

29. The acoustic resonator of claim 27 , wherein the trench is offset from the edge of second electrode by zero microns to less than 100 microns.

30. The acoustic resonator of claim 25 further comprising fill material disposed in the trench of the piezoelectric layer.

31. The acoustic resonator of claim 30 , wherein the second electrode comprises a material that is the same as the fill material in the trench.

32. The acoustic resonator of claim 30 , wherein the fill material is a material selected from the group comprising dielectrics, metals, piezoelectrics, Mo, Pt, Al, Cu, W, Au, Ag, polyimide, benzocyclobutene, SiO 2 , Si 3 N 4 , AlN, ZnO, LiNbO 3 , PZT, LiTaO 3 , and Al 2 O 3 .

33. The acoustic resonator of claim 25 , wherein the trench has a depth in the piezoelectric layer that is on the order of hundreds to thousands of angstroms and a width on the order of fractions of a micron to microns.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 47630 FRAME: 344. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 21, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0267 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 9/5/2018 PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0687. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0344 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0687 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2013
From: CITICORP NORTH AMERICA, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030422/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNEE NAME ON A DOCUMENT PREVIOUSLY RECORDED ON REEL 016005 FRAME 0375. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Recorded Apr 5, 2007
From: FENG, HONGJUN; FAZZIO, RONALD S
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 019123/0176 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RE-RECORD TO DELETE 11/201/085, ASSIGNEE NAME AND ADDRESS ON A DOCUMENT PREVIOUSLY RECORDED ON REEL 016005 FRAME 0375. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Recorded Feb 22, 2007
From: FENG, HONGJUN; FAZZIO, RONALD S
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 018921/0855 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0434 →
SECURITY AGREEMENT Recorded Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Continuity (1)
Related Publication 20060132262A1 · Jun 22, 2006