Light-emitting device
A light-emitting device of the present invention includes: a LED chip 10 ; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10 ; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70 . The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
1. A light-emitting device comprising:
a LED chip;
a chip mounting member having a heat transfer plate and a conductor pattern: said heat transfer plate being made of a heat conductive material and one surface side of which said LED chip is mounted on, said conductor pattern being formed on the one surface side of said heat transfer plate through an insulating part and electrically connected to said LED chip;
a sheet-shaped connecting member disposed on the other surface side of said heat transfer plate to connect said heat transfer plate to a metal member for holding said chip mounting member, said connecting member having an electrical insulating property and connecting said heat transfer plate and said metal member thermally to each other;
a sealing part which is made of an encapsulation resin and seals the LED chip;
an optical member which has a convex light output surface and is piled on the sealing part; and
a dome-shaped color converting member which is a molding made of a translucent material and a phosphor, the phosphor emitting a light having a color different from an emission color of the LED chip when excited by the light emitted from the LED chip, the color converting member covering the optical member from the light output surface side of the optical member, the color converting member being arranged so that an air layer is formed between the light output surface and the color converting member,
wherein said connecting member is made of an epoxy resin sheet which includes a filler and whose viscosity is reduced by heating, and
wherein said epoxy resin sheet has a high flowability in heating.
2. The light-emitting device as set forth in claim 1 , wherein
said LED chip has a light-emitting part made of a GaN-based compound semiconductor material on a main surface side of a conductive substrate formed from a SiC substrate or a GaN substrate.
3. The light-emitting device as set forth in claim 1 , further comprises
a sub-mount member which is larger in chip size than said LED chip and is disposed between said LED chip and said heat transfer plate to relieve a stress applied to said LED chip due to a difference in linear expansion coefficient between said LED chip and said heat transfer plate.
4. The light-emitting device as set forth in claim 1 , wherein said connecting member has a plane size larger than that of said heat transfer plate.