IP Library Granted Patent US 7,806,721
Granted Patent B2
US 7,806,721 · App. 12/167,031 · Granted Oct 5, 2010

Patch panel modular jack assembly

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Quick Facts
Patent No.
US 7,806,721
App. No.
12/167,031
Granted
Oct 5, 2010
Kind
B2
Abstract

A module assembly includes an interface module including a housing having a plurality of jack cavities and associated jack latch openings. The housing is configured to be mated with a patch panel. The module assembly also includes a plurality of modular jacks that are directly inserted into corresponding jack cavities. Each modular jack includes a single latch arm that engages the jack latch opening to retain the modular jack in the jack cavity. Optionally, each modular jack may include a top surface and a bottom surface, wherein the latch arm extends from the top surface and wherein the bottom surface is planar. The bottom surface may rest flush with a bottom wall of the jack cavity.

Claims (29)

1. A module assembly comprising an interface module adapted for front loading into a patch panel including:

a housing having at least one jack cavity configured to receive a modular jack therein, the modular jack including a first surface and an opposite second surface, the modular jack having a deflectable latch arm extending from the first surface, the second surface being planar, the housing having a faceplate on a front surface thereof, wherein the faceplate includes a rearward facing surface;

at least one jack latch opening configured to receive the latch arm of the modular jack; and

a latch mechanism on the housing for latching the module into the panel, the latch mechanism including a fixed latch extending outward from one side of the housing and a flexible latch extending outward from an opposite side of the housing, the flexible latch being movable between a latched position and an unlatched position to lock and unlock the housing to the patch panel, wherein when the housing is loaded into the patch panel the rearward facing surface of the faceplate is configured to engage a front of the patch panel and the latch mechanism is configured to engage a rear of the patch panel.

2. The module assembly of claim 1 , wherein the jack cavities are configured to receive the modular jacks either prior to or after the housing is mated with the patch panel.

3. The module assembly of claim 1 , wherein the faceplate is integrally formed with the housing.

4. The module assembly of claim 1 , wherein the latch mechanism is releasably latched to the patch panel such that the housing is configured to be pulled from the front of the patch panel when the latch mechanism is released.

5. The module assembly of claim 1 , wherein the at least one jack cavity comprises a plurality of jack cavities arranged in an upper row and a lower row, the latch arms of the modular jacks received in the lower row of jack cavities engaging the planar second surface of the modular jacks received in the upper row of jack cavities.

6. A module assembly comprising an interface module including:

a housing having a planar front surface, a rear surface and a plurality of jack cavities extending along a longitudinal axis perpendicular to the planar front surface, the housing having walls defining the jack cavities and the jack cavities are configured to receive modular jacks therein, wherein each modular jack includes a first surface and an opposite second surface, the modular jack having a deflectable latch arm with a hook end extending from the first surface, the second surface being planar;

a plurality of primary openings in the front surface providing access to the jack cavities;

jack latch openings in corresponding walls of each jack cavity, the jack latch openings being positioned remote from the front surface, the jack latch openings being configured to receive the hook end of the latch arm of the modular jack received within the jack cavity;

a plurality of secondary openings open through the front surface, each secondary opening being aligned with a corresponding primary opening and being aligned with a corresponding jack latch opening, the secondary openings being configured to receive a tool through the front surface for engaging and releasing the hook end of the modular jack from the jack latch opening; and

a label plate having at least one attachment feature, wherein the secondary openings are configured to receive the at least one attachment feature such that the label plate is aligned with at least one of the primary openings.

7. The module assembly of claim 6 , wherein the secondary openings are substantially horizontally aligned with the primary openings and substantially vertically aligned with the jack latch openings.

8. The module assembly of claim 6 , wherein the hook end of the latch arm includes a catch surface and a ramp surface, the jack cavity is configured to receive the modular jack such that the jack latch opening catches the catch surface and the ramp surface generally faces the secondary opening such that the tool engages and presses the ramp surface generally out of the jack latch opening as the tool is inserted into the secondary opening.

9. The module assembly of claim 6 , wherein the label plate extends across the front surface along a plurality of the primary openings.

10. The module assembly of claim 6 , wherein an equal number of primary openings, jack latch openings, and secondary openings are provided in the housing.

11. The module assembly of claim 6 , wherein the jack cavities are arranged in an upper row and a lower row, the latch arms of the modular jacks received in the lower row of jack cavities engaging the planar second surface of the modular jacks received in the upper row of jack cavities.

12. The modular assembly of claim 6 , wherein the housing is adapted for loading into a patch panel, the patch panel having a planar panel body having an opening that receives the housing, the planar front surface of the housing being oriented parallel to the planar panel body of the patch panel.

13. A module assembly comprising:

an interface module including a housing having a plurality of jack cavities and associated jack latch openings, the jack cavities are arranged in an upper row and a lower row, the housing being configured to be mated with a patch panel; and

a plurality of modular jacks being directly inserted into corresponding jack cavities, each modular jack including a first surface and an opposite second surface, each modular jack having a single latch arm extending from the first surface that engages the jack latch opening to retain the modular jack in the jack cavity, the second surface being planar, the latch arms of the modular jacks received in the lower row of jack cavities engaging the planar second surface of the modular jacks received in the upper row of jack cavities.

14. The module assembly of claim 13 , wherein each jack cavity includes a top wall having the jack latch opening and a bottom wall, the second surface defining the bottom-most portion of the modular jack, the second surface resting flush with the bottom wall.

15. The module assembly of claim 13 , wherein the modular jacks are inserted into the jack cavities either prior to or after the housing is mated with the patch panel.

16. The module assembly of claim 13 , wherein the housing has a mating end and a loading end and wherein the cavities have a longitudinal axis extending between the mating and loading ends, the modular jacks having a central axis, each modular jack being insertable into the corresponding jack cavity in a direction parallel to the longitudinal axis such that the central axis remains coincident with the longitudinal axis as the modular jack is inserted into the jack cavity.

17. The module assembly of claim 13 , wherein the jack cavities are arranged in two vertically staged rows, the interface module being configured to fit into a 1 U height requirement of the patch panel.

18. The module assembly of claim 13 , wherein the jack cavities are arranged in an upper row and a lower row that are separated by a wall of the housing, the wall defining a top wall of the jack cavities in the lower row and a bottom wall of the jack cavities in the upper row, the wall having a plurality of the jack latch openings, wherein the latch arms are sized to fit within the jack latch openings so that the modular jacks in the upper row rest flush with the wall of the housing.

19. The module assembly of claim 13 , wherein the modular jacks do not include a latch extending from the second surface such that the modular jack is insertable into the corresponding jack cavity in a linear direction.

Assignments (14)
RELEASE OF SECURITY INTEREST AT REEL/FRAME 049905/0504 Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: ARRIS ENTERPRISES LLC (F/K/A ARRIS ENTERPRISES, INC.); ARRIS TECHNOLOGY, INC.; ARRIS SOLUTIONS, INC.; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; RUCKUS WIRELESS, LLC (F/K/A RUCKUS WIRELESS, INC.)
Reel/Frame 071477/0255 →
SECURITY INTEREST Recorded Dec 17, 2024
From: ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE INC., OF NORTH CAROLINA; OUTDOOR WIRELESS NETWORKS LLC; RUCKUS IP HOLDINGS LLC
To: APOLLO ADMINISTRATIVE AGENCY LLC
Reel/Frame 069889/0114 →
SECURITY INTEREST Recorded Nov 19, 2021
From: ARRIS SOLUTIONS, INC.; ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA; RUCKUS WIRELESS, INC.
To: WILMINGTON TRUST
Reel/Frame 060752/0001 →
ABL SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; ARRIS ENTERPRISES LLC; ARRIS TECHNOLOGY, INC.; RUCKUS WIRELESS, INC.; ARRIS SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 049892/0396 →
TERM LOAN SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; ARRIS ENTERPRISES LLC; ARRIS TECHNOLOGY, INC.; RUCKUS WIRELESS, INC.; ARRIS SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 049905/0504 →
PATENT SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE TECHNOLOGIES LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 049892/0051 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2019
From: JPMORGAN CHASE BANK, N.A.
To: REDWOOD SYSTEMS, INC.; ALLEN TELECOM LLC; ANDREW LLC; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 048840/0001 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2019
From: JPMORGAN CHASE BANK, N.A.
To: REDWOOD SYSTEMS, INC.; ALLEN TELECOM LLC; ANDREW LLC; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 049260/0001 →
PATENT SECURITY AGREEMENT (TERM) Recorded Jan 13, 2016
From: COMMSCOPE TECHNOLOGIES LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 037513/0709 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 13, 2016
From: COMMSCOPE TECHNOLOGIES LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 037514/0196 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2015
From: COMMSCOPE EMEA LIMITED
To: COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 037012/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2015
From: TYCO ELECTRONICS SERVICES GMBH
To: COMMSCOPE EMEA LIMITED
Reel/Frame 036956/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: TYCO ELECTRONICS CORPORATION
To: TYCO ELECTRONICS SERVICES GMBH
Reel/Frame 036074/0740 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2008
From: HERNDON, STEPHEN SCOTT; BURWELL, ROBERT JEFFREY; GENIAC, JOSEPH EDWARD; DOOLEY, CHRISTINE ANNE
To: TYCO ELECTRONICS CORPORATION
Reel/Frame 021190/0051 →